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Keywords: Sn–Ag–Cu
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
Published Online: November 13, 2008
... enhance the electromigration reliability. 01 08 2007 07 01 2008 13 11 2008 copper alloys electromigration flip-chip devices gold nickel reliability silver alloys solders tin alloys titanium vanadium electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...
