... ball grid arrays finite element analysis Rayleigh-Ritz methods bending stress analysis fatigue The application of ball grid array (BGA) technology has grown significantly in recent years. Although thermal fatigue is always an issue, electronic devices are also frequently subject to high...

... integrated circuit reliability integrated circuit packaging ball grid arrays integrated circuit modelling life testing integrated circuit testing viscoplasticity stress analysis reflow soldering Rayleigh-Ritz methods failure analysis finite element analysis Recent years have witnessed...

... Rayleigh-Ritz Method for Thermomechanical Stress Analysis of Surface Mount Interconnects in Electronic Assemblies,” Ph.D. dissertation, Univ., of Maryland), that is based on a nested multi-field displacement assumption. The nested multi-field displacement technique may be viewed as a localized cascading...