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Keywords: QFP devices
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
Published Online: September 6, 2013
...; published online September 6, 2013. Assoc. Editor: Yi-Shao Lai. 10 04 2013 25 07 2013 The feasibility of laser direct welding quad flat pack (QFP) device without solder is analyzed and practiced. The relations between the tensile strength of QFP joints and laser welding parameters...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
Published Online: April 1, 2009
...Zongjie Han; Songbai Xue; Jianxin Wang; Xin Zhang; Shenglin Yu; Liang Zhang In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering system, and compared...
