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Keywords: IC packaging
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
Published Online: September 20, 2006
... of Taiwan IC packaging company in this study; and ( b ) the back end process of a general IC packaging For most of the IC strip, one single chip would be laid in a pitch of IC strip. So, the target of molding model in this paper focuses on one single IC chip. With the center of the selected IC chip...
