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Keywords: Cu substrate
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
Published Online: June 11, 2012
...Chu-Hsuan Sha; Wen P. Lin; Chin C. Lee Copper–silver (Cu–Ag) composite flip-chip interconnect between silicon (Si) chips and Cu substrates is demonstrated. Array of Cu–Ag columns, each 28 μ m in height and 40 μ m in diameter, is electroplated on 2-in. Si wafers coated with chromium (Cr)/gold (Au...
