... in conducting heat to the heatsink [ 4 – 6 ]. Composite materials Conductive adhesives Harsh environment Nanotechnolgy Reliability Thermal analysis 15 10 2017 09 04 2018 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E...

... for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received November 12, 2016; final manuscript received September 28, 2017; published online October 25, 2017. Assoc. Editor: Shi-Wei Ricky Lee. 12 11 2016 28 09 2017 Conductive adhesives Power packaging Reliability...

... manuscript received May 31, 2017; published online July 14, 2017. Assoc. Editor: Xiulin Ruan. 30 01 2017 31 05 2017 Area array BGA Conductive adhesives Conductive Inks Conformal coatings Electronic Flip chip High density interconnects Microsystems PWB Rework SMT Underfill...

... is unlimited. 24 06 2016 04 11 2016 Composite materials Conductive adhesives Microsystems Solder Thermal analysis The performance characteristics of TIMs continue to improve rapidly with the development of novel nanostructured materials and advanced manufacturing processes...

... Progresses on Hybrid Micro–Nano Filler Systems for Electrically Conductive Adhesives (ECAs) Applications ,” J. Mater. Sci. Mater. Electron. , 26 ( 7 ), pp. 4730 – 4745 . 10.1007/s10854-015-3016-1 [48] Applied Nanoparticle Laboratory and Toyota Motor , 2013 , “ Three-Metallic-Component Type...

... in the heat transfer direction. The approach is different than Raytheon's as it has no interposer. GT applied extensive measurement capability to their effort, includes the use of infrared microscopy for thermal resistance measurements [ 14 ]. Thermally conductive adhesives are used as the attachment material...

..., and higher thermal stability of ACF joints compared with the conventional Au-coated polymer ball and Au-coated Ni ball-filled anisotropically conductive adhesives. 28 08 2009 03 01 2010 19 03 2010 19 03 2010 coating techniques coatings conductive adhesives copper integrated...

...Melida Chin; S. Jack Hu; James R. Barber Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important...

..., the need to eliminate lead-based materials as a means of interconnection has renewed the industry’s interest in exploring other means of assembling surface mount devices reliably. The use of a novel anisotropic conductive adhesive (ACA) as a means for assembling surface mount devices, the ACA’s performance...