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Keywords: COP
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
... 2011 14 09 2011 cooling graphs integrated circuit packaging thermoelectricity Thermoelectric cooler design COP performance 3D TEC system analysis In recent years, cooling high heat flux systems such as computer microprocessors, logic memory, and power supplies have...
