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Keywords: ACF
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
...W. K. Chiang; Y. C. Chan This paper presents the reliability of anisotropic conductive film (ACF) joint tested under reflow soldering and environmental test effect. The ACF joint behaved differently under different reflow soldering profiles. The lower reflow temperature resulted in more reliable...