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Journal Articles

Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag., 145 (2), p. 021005)

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017002.
Paper No: EP-23-1076
https://doi.org/10.1115/1.4063546
Published Online: October 5, 2023
View Article titled, Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag., 145 (2), p. 021005)
Open the PDF for Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Electron. Packag., 145 (2), p. 021005) in another window
Topics: Dynamic modeling, Electrons, Power conversion systems, Stress
Journal Articles

Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]

Wing K. Yeung, Tung T. Lam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2024, 146(1): 017001.
Paper No: EP-23-1056
https://doi.org/10.1115/1.4063174
Published Online: August 25, 2023
View Article titled, Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ]
Open the PDF for Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948 ] in another window
Topics: Electrons, Current density
Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
https://doi.org/10.1115/1.4038735
Published Online: March 2, 2018
View Article titled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]
Open the PDF for Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ] in another window
Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire
Journal Articles

Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2017, 139(1): 017001.
Paper No: EP-16-1133
https://doi.org/10.1115/1.4035707
Published Online: January 19, 2017
View Article titled, Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
Open the PDF for Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927] in another window
Topics: Electrons, Packaging
Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. September 2016, 138(3): 037001.
Paper No: EP-16-1057
https://doi.org/10.1115/1.4033633
Published Online: May 25, 2016
View Article titled, Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]
Open the PDF for Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ] in another window
Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders
Journal Articles

Erratum: “A Stepped-Bar Apparatus for Thermal Resistance Measurements” [Journal of Electronic Packaging, 2013, 135(4), 041002]

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. December 2013, 135(4): 047001.
Paper No: EP-13-1117
https://doi.org/10.1115/1.4025800
Published Online: November 13, 2013
View Article titled, Erratum: “A Stepped-Bar Apparatus for Thermal Resistance Measurements” [Journal of Electronic Packaging, 2013, 135(4), 041002]
Open the PDF for Erratum: “A Stepped-Bar Apparatus for Thermal Resistance Measurements” [Journal of Electronic Packaging, 2013, 135(4), 041002] in another window
Topics: Electronic packaging, Thermal resistance
Journal Articles

Erratum: “Strains in Aluminum-Adhesive-Ceramic Trilayers” (Journal of Electronic Packaging, 1990, 112, p. 288)

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 1991, 113(1): 26.
https://doi.org/10.1115/1.2905362
Published Online: March 1, 1991
View Article titled, Erratum: “Strains in Aluminum-Adhesive-Ceramic Trilayers” (Journal of Electronic Packaging, 1990, 112, p. 288)
Open the PDF for Erratum: “Strains in Aluminum-Adhesive-Ceramic Trilayers” (Journal of Electronic Packaging, 1990, 112, p. 288) in another window
Topics: Adhesives, Aluminum, Ceramics, Electronic packaging
Journal Articles

Erratum: “An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water” (Journal of Electronic Packaging, 1989, 111, pp. 33–40)

Y. Joshi, T. Willson, S. J. Hazard
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. June 1989, 111(2): 142.
https://doi.org/10.1115/1.3226519
Published Online: June 1, 1989
View Article titled, Erratum: “An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water” (Journal of Electronic Packaging, 1989, 111, pp. 33–40)
Open the PDF for Erratum: “An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel in Water” (Journal of Electronic Packaging, 1989, 111, pp. 33–40) in another window
Topics: Cooling, Electronic packaging, Natural convection, Water