1-15 of 15
Young's modulus
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
Open the PDF for Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling in another window
Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
Open the PDF for Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics in another window
Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation

Muhammad Sadiq, Jean-Sebastien Lecomte, Mohammed Cherkaoui
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031005.
Paper No: EP-13-1135
https://doi.org/10.1115/1.4029836
Published Online: September 1, 2015
View Article titled, Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Open the PDF for Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead-Free Solders Incorporating Special Pileup Effects Using Nanoindentation in another window
Topics: Alloys, Mechanical properties, Nanoindentation, Temperature, Tin, Young's modulus, Lead-free solders
Journal Articles

The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations

Ningbo Liao, Ping Yang, Miao Zhang, Wei Xue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
https://doi.org/10.1115/1.4003513
Published Online: June 7, 2011
View Article titled, The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations
Open the PDF for The Effects of Thermal Loading on the Mechanical Properties of Interfaces of Dissimilar Materials by Nanoindentation Simulations in another window
Topics: Mechanical properties, Nanoindentation, Simulation, Young's modulus, Molecular dynamics simulation, Heat transfer
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
View Article titled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
Open the PDF for Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package in another window
Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus
Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
https://doi.org/10.1115/1.1827271
Published Online: January 24, 2005
View Article titled, Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
Open the PDF for Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array in another window
Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis
Journal Articles

Warpage Analysis of Underfilled Wafers

Hai Ding, I. Charles Ume, Cheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 265–270.
https://doi.org/10.1115/1.1707036
Published Online: July 8, 2004
View Article titled, Warpage Analysis of Underfilled Wafers
Open the PDF for Warpage Analysis of Underfilled Wafers in another window
Topics: Finite element analysis, Semiconductor wafers, Shades and shadows, Warping, Young's modulus, Design, Regression analysis, Regression models
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
Open the PDF for Characterization of Substrate Materials for System-in-a-Package Applications in another window
Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 59–66.
https://doi.org/10.1115/1.1533058
Published Online: March 14, 2003
View Article titled, Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
Open the PDF for Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders in another window
Topics: Solders, Temperature, Tensile strength, Tin, Yield stress, Young's modulus, Creep, Stress
Journal Articles

Reliability Analysis of Flip Chip Designs Via Computer Simulation

Hua Lu, C. Bailey, M. Cross
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 214–219.
https://doi.org/10.1115/1.1286122
Published Online: January 17, 2000
View Article titled, Reliability Analysis of Flip Chip Designs Via Computer Simulation
Open the PDF for Reliability Analysis of Flip Chip Designs Via Computer Simulation in another window
Topics: Computer simulation, Fatigue, Flip-chip, Flip-chip devices, Geometry, Materials properties, Reliability, Solder joints, Solders, Young's modulus
Journal Articles

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

S. Rzepka, M. A. Korhonen, E. Meusel, C.-Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 342–348.
https://doi.org/10.1115/1.2792644
Published Online: December 1, 1998
View Article titled, The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
Open the PDF for The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints in another window
Topics: Delamination, Flip-chip, Solder joints, Thermal stresses, Solders, Stress, Adhesion, Damage, Failure, Finite element analysis
Journal Articles

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

M. Uschitsky, E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
https://doi.org/10.1115/1.1325009
Published Online: September 2, 1998
View Article titled, Moisture Diffusion in Epoxy Molding Compounds Filled With Particles
Open the PDF for Moisture Diffusion in Epoxy Molding Compounds Filled With Particles in another window
Topics: Diffusion (Physics), Epoxy adhesives, Epoxy resins, Fillers (Materials), Mechanical properties, Molding, Particulate matter, Sorption, Indium compounds, Stress
Journal Articles

How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 1995, 117(1): 88–92.
https://doi.org/10.1115/1.2792073
Published Online: March 1, 1995
View Article titled, How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
Open the PDF for How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing? in another window
Topics: Adhesives, Bending (Stress), Diluents, Elastic constants, Epoxy adhesives, Manufacturing, Mechanical behavior, Rails, Silicones, Stiffness
Journal Articles

Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature

E. Suhir, L. T. Manzione
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 329–335.
https://doi.org/10.1115/1.2905459
Published Online: September 1, 1992
View Article titled, Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature
Open the PDF for Predicted Bow of Plastic Packages Due to the Nonuniform Through-Thickness Distribution of Temperature in another window
Topics: Temperature, Molding, Warping, Cycles, Design, Geometry, Hardening (Curing), Materials properties, Molded plastics, Optimization
Journal Articles

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Q. Guo, E. C. Cutiongco, L. M. Keer, M. E. Fine
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 145–151.
https://doi.org/10.1115/1.2906411
Published Online: June 1, 1992
View Article titled, Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
Open the PDF for Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder in another window
Topics: Fatigue life, Solders, Thermomechanics, Failure, Fatigue testing, Cycles, Fatigue, Compressive stress, Dislocations, Stress