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Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
https://doi.org/10.1115/1.4054462
Published Online: July 7, 2022
View Article titled, Electrothermal Analysis of System in Package for Aerospace Application
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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
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Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement

Ashish Sinha, Yogendra K Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
https://doi.org/10.1115/1.4005290
Published Online: December 9, 2011
View Article titled, Downhole Electronics Cooling Using a Thermoelectric Device and Heat Exchanger Arrangement
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Topics: Copper, Heat, Heat exchangers, Temperature, Thermal management, Thermoelectric devices, Water, Manufacturing, Fluids, Cooling
Journal Articles

Measurement of Leak Rate for MEMS Vacuum Packaging

Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Lin, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
https://doi.org/10.1115/1.3144148
Published Online: October 16, 2009
View Article titled, Measurement of Leak Rate for MEMS Vacuum Packaging
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Topics: Leakage, Packaging, Vacuum, Pressure, Flow (Dynamics)
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Article titled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

J. Zhu, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 160–165.
https://doi.org/10.1115/1.2792609
Published Online: June 1, 1998
View Article titled, Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Finite element analysis, Diffraction patterns, Electronic packaging, Interferometry, Reliability, Temperature, Diffraction gratings, Displacement
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Article titled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
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Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure
Journal Articles

Reliable Ceramic Window Design for Electronic Devices

Hsien-Yang Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 349–352.
https://doi.org/10.1115/1.2905462
Published Online: September 1, 1992
View Article titled, Reliable Ceramic Window Design for Electronic Devices
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Topics: Ceramics, Design, Fracture (Materials), Vacuum, Leakage, Traveling waves, Approximation, Fracture mechanics, Heating, Plates (structures)
Journal Articles

Analysis of Brazing Stresses in Ceramic-Metal Joints in High-Vacuum Devices

K. L. De Weese, C. E. Toups, C. K. H. Dharan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 21–25.
https://doi.org/10.1115/1.3226503
Published Online: March 1, 1989
View Article titled, Analysis of Brazing Stresses in Ceramic-Metal Joints in High-Vacuum Devices
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Topics: Brazing, Ceramics, Metals, Stress, Vacuum, Materials properties, Temperature, Temperature effects, Alloys, Boundary-value problems