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Journal Articles

An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder

G. Y. Li, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 305–310.
https://doi.org/10.1115/1.1486012
Published Online: July 26, 2002
View Article titled, An Investigation of Intermetallics Formation Between Pd/Ag Metallization and Sn/Pb/Ag Solder
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Topics: Electron diffraction, Intermetallic compounds, Solder joints, Solders, Tin, X-ray diffraction, Silver, X-rays, Transmission electron microscopy, Thick films
Journal Articles

Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]

Zongrong Liu and, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. June 2001, 123(2): 159.
https://doi.org/10.1115/1.1371772
Published Online: June 1, 2001
View Article titled, Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69]
Open the PDF for Erratum: “Development of Glass-Free Metal Electrically Conductive Thick Films” [ASME J. Electron. Packag., 123 , No. 1, pp. 64–69] in another window
Topics: Electrons, Glass, Metals, Thick films, Adhesion, Electrical resistance, Packaging, Titanium alloys
Journal Articles

Development of Glass-Free Metal Electrically Conductive Thick Films

Zongrong Liu, D. D. L. Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
https://doi.org/10.1115/1.1329131
Published Online: July 13, 2000
View Article titled, Development of Glass-Free Metal Electrically Conductive Thick Films
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Topics: Electrical resistivity, Glass, Metals, Thick films, Adhesion, Alloys
Journal Articles

Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

J. Campbell, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 241–245.
https://doi.org/10.1115/1.2792099
Published Online: September 1, 1995
View Article titled, Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor
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Topics: Thick films, Wetting, Temperature, Tin, Alloys, Atoms, Diffusion (Physics), Intermetallic compounds, Solders