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Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031015.
Paper No: EP-13-1050
https://doi.org/10.1115/1.4028013
Published Online: July 24, 2014
View Article titled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature
Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
https://doi.org/10.1115/1.2227057
Published Online: August 7, 2005
View Article titled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip
Journal Articles

Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium

T. Nowak, R. J. Pryputniewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1992, 114(1): 71–80.
https://doi.org/10.1115/1.2905444
Published Online: March 1, 1992
View Article titled, Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium
Open the PDF for Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium in another window
Topics: Drilling, Lasers, Transparency, Laser beams, Shapes, Computer simulation, Errors, Experimental analysis, Geometry, Temperature