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Journal Articles

Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method

Chao Gao, Chunyue Huang, Liang Ying
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
https://doi.org/10.1115/1.4064097
Published Online: December 11, 2023
View Article titled, Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method
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Topics: Design, Manufacturing, Solder joints, Stress, Taguchi methods, Reliability, Fatigue life, Optimization, Ball-Grid-Array packaging
Journal Articles

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011002.
Paper No: EP-17-1035
https://doi.org/10.1115/1.4038245
Published Online: March 2, 2018
View Article titled, Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging
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Topics: Density, Design, Finite element model, Packaging, Reliability, Semiconductor wafers, Solder joints, Solders, Stress, Fatigue life
Journal Articles

Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method

Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041007.
Paper No: EP-13-1018
https://doi.org/10.1115/1.4025597
Published Online: November 5, 2013
View Article titled, Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
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Topics: Cycles, Design, Fatigue, Fatigue life, Reliability, Solder joints, Temperature, Materials properties, Stress, Taguchi methods
Journal Articles

Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet

Yu-Tang Yen, Te-Hua Fang, Yu-Cheng Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041005.
https://doi.org/10.1115/1.4002723
Published Online: November 24, 2010
View Article titled, Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet
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Topics: Bonding, Taguchi methods, Warping, Design
Journal Articles

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Chung-Feng Jeffrey Kuo, Hui-Ta Chen, Te-Li Su, Jr-Da Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041006.
https://doi.org/10.1115/1.4002727
Published Online: November 24, 2010
View Article titled, Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes
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Topics: Bonding, Flip-chip, Light-emitting diodes, Leakage, Taguchi methods
Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
https://doi.org/10.1115/1.4000363
Published Online: November 12, 2009
View Article titled, Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
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Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat
Journal Articles

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

Wen-Ren Jong, Hsin-Chun Tsai, Hsiu-Tao Chang, Shu-Hui Peng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
https://doi.org/10.1115/1.2837508
Published Online: January 31, 2008
View Article titled, The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
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Topics: Creep, Lead-free solders, Semiconductor wafers, Shear (Mechanics), Solder joints, Taguchi methods, Temperature, Solders, Low temperature
Journal Articles

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Wataru Nakayama, Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 440–448.
https://doi.org/10.1115/1.1827259
Published Online: January 24, 2005
View Article titled, A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model
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Topics: Computational fluid dynamics, Design, Electronic equipment, Simulation, Thermal analysis, Taguchi methods, Temperature, Thermal resistance
Journal Articles

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
https://doi.org/10.1115/1.1569957
Published Online: June 10, 2003
View Article titled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
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Topics: Computer-aided design, Design, Design methodology, Flow (Dynamics), Taguchi methods, Noise factors, Molding, Packaging, Simulation, Manufacturing