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Journal Articles

Design Guideline for Ball Impact Test Apparatus

Chang-Lin Yeh, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
https://doi.org/10.1115/1.2429716
Published Online: April 18, 2006
View Article titled, Design Guideline for Ball Impact Test Apparatus
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Topics: Brittleness, Design, Fracture (Process), Impact testing, Reliability, Solder joints, Transients (Dynamics), Damping, Structural dynamics
Journal Articles

A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards

J. M. Pitarresi, A. V. Di Edwardo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 118–123.
https://doi.org/10.1115/1.2909291
Published Online: March 1, 1993
View Article titled, A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards
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Topics: Circuits, Design, Algorithms, Finite element analysis, Finite element methods, Modeling, Structural dynamics
Journal Articles

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Tin-Lup Wong, Karl K. Stevens, Gang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 244–249.
https://doi.org/10.1115/1.2905402
Published Online: September 1, 1991
View Article titled, Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components
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Topics: Dynamic models, Dynamic response, Electronic components, Lumber, Modal analysis, Mode shapes, Structural dynamics, Surface mount components, Surface mount packaging, Testing