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Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
https://doi.org/10.1115/1.4007118
Published Online: July 23, 2012
View Article titled, Effect of Shield-Can on Dynamic Response of Board-Level Assembly
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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing
Journal Articles

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Sushma Madduri, William Infantolino, Bahgat.G Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011007.
https://doi.org/10.1115/1.4005911
Published Online: March 19, 2012
View Article titled, An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
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Topics: Epoxy adhesives, Epoxy resins, Temperature, Temperature effects, Stress analysis (Engineering)
Journal Articles

Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading

Samson Yoon, Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
https://doi.org/10.1115/1.2912181
Published Online: May 14, 2008
View Article titled, Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading
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Topics: Diffusion (Physics), Finite element analysis, Heat transfer, Modeling, Semiconductors (Materials), Stress, Stress analysis (Engineering), Temperature, Deformation, Thermal expansion
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Article titled, Hygrothermal Cracking Analysis of Plastic IC Package
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Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 569–575.
https://doi.org/10.1115/1.1604803
Published Online: December 15, 2003
View Article titled, Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
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Topics: Boundary element methods, Delamination, Fracture (Materials), Stress, Corners (Structural elements), Stress analysis (Engineering)
Journal Articles

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

John H. Lau, Stephen H. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2003, 125(4): 621–624.
https://doi.org/10.1115/1.1604805
Published Online: December 15, 2003
View Article titled, 3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components
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Topics: Boundary-value problems, Compressive stress, Copper, Finite element analysis, Stress, Stress analysis (Engineering), Tin, Chemical reactions, Displacement, Materials properties
Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
https://doi.org/10.1115/1.1535446
Published Online: March 14, 2003
View Article titled, Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics
Journal Articles

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Mehrdad N. Ghasemi Nejhad, Mem. ASME, Chiling Pan, Hongwei Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
https://doi.org/10.1115/1.1512295
Published Online: March 14, 2003
View Article titled, Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
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Topics: Finite element analysis, Modeling, Residual stresses, Stress, Stress analysis (Engineering), Temperature, Thin films, Microelectromechanical systems
Journal Articles

Thermomechanical Durability of High I/O BGA Packages

P. Davuluri, S. Shetty, A. Dasgupta, S. Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 266–270.
https://doi.org/10.1115/1.1477192
Published Online: July 26, 2002
View Article titled, Thermomechanical Durability of High I/O BGA Packages
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Topics: Ball-Grid-Array packages, Cycles, Durability, Failure, Modeling, Solder joints, Solders, Stress, Stress analysis (Engineering), Thermomechanics
Journal Articles

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

Xiaoling He, Robert E. Fulton, Fellow ASME Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 77–84.
https://doi.org/10.1115/1.1457454
Published Online: May 2, 2002
View Article titled, Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board
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Topics: Deflection, Laminates, Printed circuit boards, Stress, Nonlinear dynamics, Stress analysis (Engineering), Deformation, Equations of motion, Resonance
Journal Articles

Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering

Chia-Yu Fu, David L. McDowell, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 45–53.
https://doi.org/10.1115/1.1401737
Published Online: January 1, 2001
View Article titled, Thermoplastic Finite Element Analysis of Unfilled Plated-Through Holes During Wave Soldering
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Topics: Cooling, Corners (Structural elements), Finite element analysis, Printed circuit boards, Stress, Stress analysis (Engineering), Temperature, Transients (Dynamics), Wave soldering, Copper
Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Krishna Darbha, Abhijit Dasgupta, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 141–146.
https://doi.org/10.1115/1.1328744
Published Online: October 10, 2000
View Article titled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation
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Topics: Displacement, Finite element analysis, Potential energy, Stress, Stress analysis (Engineering), Creep, Thermomechanics, Electronic products
Journal Articles

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Krishna Darbha, Abhijit Dasgupta, Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. June 2001, 123(2): 147–155.
https://doi.org/10.1115/1.1328745
Published Online: October 10, 2000
View Article titled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects
Open the PDF for A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects in another window
Topics: Ball-Grid-Array packaging, Creep, Finite element analysis, Flip-chip devices, Manufacturing, Solders, Stress, Stress analysis (Engineering), Durability, Temperature
Journal Articles

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 6–15.
https://doi.org/10.1115/1.1326437
Published Online: July 1, 2000
View Article titled, Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards
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Topics: Copper, Double refraction, Drilling, Drills (Tools), Epoxy resins, Failure, Failure analysis, Finite element analysis, Fracture (Materials), Glass
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill

K. Darbha, J. H. Okura, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 231–236.
https://doi.org/10.1115/1.2793845
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1—Without Underfill
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Topics: Durability, Flip-chip devices, Solders, Thermomechanics, Flip-chip, Damage, Stress, Stress analysis (Engineering), Finite element model, Modeling
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 237–241.
https://doi.org/10.1115/1.2793846
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
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Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles
Journal Articles

Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process

Kang Yong Lee, Taek Sung Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 148–155.
https://doi.org/10.1115/1.2792677
Published Online: September 1, 1999
View Article titled, Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process
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Topics: Fracture (Materials), Fracture (Process), Reflow soldering, Delamination, Design, Finite difference methods, Fracture mechanics, Heating, Integrated circuits, Shapes
Journal Articles

Stress Analysis of Thermal Inclusions With Interior Voids and Cracks

C. Q. Ru
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 192–199.
https://doi.org/10.1115/1.1286020
Published Online: August 30, 1999
View Article titled, Stress Analysis of Thermal Inclusions With Interior Voids and Cracks
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Topics: Fracture (Materials), Stress, Stress analysis (Engineering), Thermal stresses
Journal Articles

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

L. Maciucescu, T.-L. Sham, E. Krempl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 92–98.
https://doi.org/10.1115/1.2792673
Published Online: June 1, 1999
View Article titled, Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)
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Topics: Alloys, Deformation, Modeling, Solders, Tin, Viscoplasticity, Accounting, Creep, Solder joints, Stress analysis (Engineering)
Journal Articles

Tools for Stress Analysis of Microelectronic Structures

Boris Mirman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 280–282.
https://doi.org/10.1115/1.1286104
Published Online: December 11, 1998
View Article titled, Tools for Stress Analysis of Microelectronic Structures
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Topics: Stress analysis (Engineering)