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Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031001.
Paper No: EP-20-1111
https://doi.org/10.1115/1.4051620
Published Online: September 15, 2021
View Article titled, Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures
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Topics: Fatigue, Solder joints, Stiffness, Stress, Temperature, Failure, Deformation, Manufacturing, Shear (Mechanics)
Journal Articles

Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties

Karl F. Schoch, Jr., Philip A. Panackal, M. Garrett Bimstefer, Amanda N. Brocki, Daniel N. Urban
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031008.
Paper No: EP-21-1040
https://doi.org/10.1115/1.4052076
Published Online: September 15, 2021
View Article titled, Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties
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Topics: Putties, Shapes, Stress, Stiffness, Compression, Pressure
Journal Articles

Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design

Bryce P. DeFigueiredo, Trent K. Zimmerman, Brian D. Russell, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041001.
Paper No: EP-17-1120
https://doi.org/10.1115/1.4040552
Published Online: July 3, 2018
View Article titled, Regional Stiffness Reduction Using Lamina Emergent Torsional Joints for Flexible Printed Circuit Board Design
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Topics: Design, Hinges, Printed circuit boards, Stiffness, Stress, Deflection, Finite element analysis, Engineering prototypes, Materials properties
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Article titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties
Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
https://doi.org/10.1115/1.4032497
Published Online: March 10, 2016
View Article titled, Analytical Solution for Electronic Assemblies Under Vibration
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Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis
Journal Articles

Simulation of Secondary Contact to Generate Very High Accelerations

Stuart T. Douglas, Moustafa Al-Bassyiouni, Abhijit Dasgupta, Kevin Gilman, Aaron Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031011.
Paper No: EP-13-1121
https://doi.org/10.1115/1.4030685
Published Online: September 1, 2015
View Article titled, Simulation of Secondary Contact to Generate Very High Accelerations
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Topics: Damping, Elastomers, Finite element analysis, Simulation, Springs, Stiffness, Modeling, Manufacturing, Clearances (Engineering)
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
View Article titled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Journal Articles

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

S. Chaparala, J. M. Pitarresi, S. Parupalli, S. Mandepudi, M. Meilunas
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 441–448.
https://doi.org/10.1115/1.2353280
Published Online: February 23, 2006
View Article titled, Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
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Topics: Ball-Grid-Array packaging, Manufacturing, Reliability, Stiffness, Mirrors, Cycles, Solder joints, Solders, Finite element analysis, Capacitors
Journal Articles

Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules

Bivragh Majeed, Kieran Delaney, John Barton, Niall McCarthy, Sean C. O’Mathuna, John Alderman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 236–245.
https://doi.org/10.1115/1.2229221
Published Online: November 24, 2005
View Article titled, Fabrication and Characterization of Flexible Substrates for Use in the Development of Miniaturized Wireless Sensor Network Modules
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Topics: Circuits, Copper, Manufacturing, Packaging, Polymers, Semiconductor wafers, Stiffness, Stress, Wireless sensor networks, Lasers
Journal Articles

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 386–391.
https://doi.org/10.1115/1.1602703
Published Online: September 17, 2003
View Article titled, Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
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Topics: Contact resistance, Particulate matter, Thermal conductivity, Percolation theory, Stiffness, Modeling, Polymers, Fillers (Materials)
Journal Articles

Effective Local Flexural Stiffness of Ball Grid Array Assemblies

Jung-Chuan Lee, Mem. ASME, Mostafa Rassaian, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 192–197.
https://doi.org/10.1115/1.1463733
Published Online: July 26, 2002
View Article titled, Effective Local Flexural Stiffness of Ball Grid Array Assemblies
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Topics: Ball-Grid-Array packaging, Displacement, Stiffness, Finite element methods, Deflection, Printed circuit boards, Stress
Journal Articles

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

S. M. Heinrich, S. Shakya, J. Liang, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 328–334.
https://doi.org/10.1115/1.1289631
Published Online: January 28, 2000
View Article titled, An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects
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Topics: Creep, Displacement, Shear (Mechanics), Stiffness, Shear deformation, Shapes, Stress, Viscoelastic materials, Viscoelasticity, Solders
Journal Articles

An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects

J. A. Swanson, S. M. Heinrich, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 303–311.
https://doi.org/10.1115/1.2793857
Published Online: December 1, 1999
View Article titled, An Elastoplastic Beam Model for Column-Grid-Array Solder Interconnects
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Topics: Solders, Shear (Mechanics), Deflection, Stiffness, Stress, Deformation, Die cutting, Displacement, Fatigue life, Finite element model
Journal Articles

Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board

Ephraim Suhir, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 3–5.
https://doi.org/10.1115/1.483134
Published Online: August 31, 1999
View Article titled, Predicted Fundamental Vibration Frequency of a Heavy Electronic Component Mounted on a Printed Circuit Board
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Topics: Electronic components, Oscillating frequencies, Oscillations, Printed circuit boards, Vibration, Stiffness, Resonance, Fatigue, Free vibrations
Journal Articles

Shearing Deformation in Partial Areal Arrays: Analytical Results

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 18–23.
https://doi.org/10.1115/1.2792279
Published Online: March 1, 1998
View Article titled, Shearing Deformation in Partial Areal Arrays: Analytical Results
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Topics: Boundary-value problems, Corners (Structural elements), Die cutting, Dimensions, Displacement, Elasticity, Fatigue life, Finite element analysis, Finite element model, Geometry
Journal Articles

Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw

R. K. Sahoo, V. Prasad, I. Kao, J. Talbott, K. P. Gupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 35–40.
https://doi.org/10.1115/1.2792283
Published Online: March 1, 1998
View Article titled, Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
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Topics: Design, Semiconductor wafers, Wire, Cutting, Algorithms, Feedback, Finishes, Finite element methods, Fracture (Materials), Fracture (Process)
Journal Articles

Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 12–17.
https://doi.org/10.1115/1.2792278
Published Online: March 1, 1998
View Article titled, Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects
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Topics: Displacement, Solders, Die cutting, Dimensions, Shearing (Deformation), Thermal energy, Elastic moduli, High temperature, Manufacturing, Relaxation (Physics)
Journal Articles

Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints

S. M. Heinrich, S. Shakya, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 218–227.
https://doi.org/10.1115/1.2792240
Published Online: December 1, 1997
View Article titled, Improved Analytical Estimate of Global CTE Mismatch Displacement in Areal-Array Solder Joints
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Topics: Displacement, Solder joints, Manufacturing, Materials properties, Shear (Mechanics), Boundary-value problems, Die cutting, Dimensions, Disks, Finite element analysis
Journal Articles

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

K. Darbha, S. Ling, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 183–188.
https://doi.org/10.1115/1.2792232
Published Online: September 1, 1997
View Article titled, Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading
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Topics: Stress analysis (Engineering), Surface mount packaging, Printed circuit boards, Solder joints, Stress, Vibration, Boundary-value problems, Damage, Deformation, Fatigue