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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Ruina Xu, Gaoyuan Wang, Peixue Jiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010802.
Paper No: EP-20-1114
https://doi.org/10.1115/1.4050046
Published Online: August 6, 2021
View Article titled, Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms
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Topics: Cooling, Heat transfer, Sprays, Critical heat flux, Drops
Journal Articles

Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management

Huseyin Bostanci, Vishnu V. R. Yata, Suresh Kaluvan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031004.
Paper No: EP-20-1101
https://doi.org/10.1115/1.4049174
Published Online: January 19, 2021
View Article titled, Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management
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Topics: Cooling, Flow (Dynamics), Sprays, Temperature, Heat
Journal Articles

Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a

Eduardo Martínez-Galván, Juan Carlos Ramos, Raúl Antón, Rahmatollah Khodabandeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011002.
https://doi.org/10.1115/1.4001857
Published Online: March 3, 2011
View Article titled, Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a
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Topics: Cooling, Film thickness, Heat flux, Heat transfer, Sprays, Refrigerants, Critical heat flux, Temperature, Boiling
Journal Articles

Spray Cooling of IGBT Devices

Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 316–323.
https://doi.org/10.1115/1.2753937
Published Online: May 18, 2007
View Article titled, Spray Cooling of IGBT Devices
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Topics: Cooling, Heat flux, Sprays, Temperature, Water, Junctions, Cycles
Journal Articles

A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays

Milan Visaria, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 452–459.
https://doi.org/10.1115/1.2804095
Published Online: March 26, 2007
View Article titled, A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays
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Topics: Critical heat flux, Nozzles, Sprays, Flow (Dynamics)
Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
https://doi.org/10.1115/1.1289635
Published Online: August 9, 1999
View Article titled, Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
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Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)
Journal Articles

Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays

Kurt A. Estes, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 323–332.
https://doi.org/10.1115/1.2792112
Published Online: December 1, 1995
View Article titled, Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays
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Topics: Computer cooling, Jets, Sprays, Cooling, Critical heat flux, Subcooling, Flow (Dynamics), Liquid films, Boiling, Coolants