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Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031011.
Paper No: EP-18-1099
https://doi.org/10.1115/1.4043480
Published Online: May 24, 2019
View Article titled, Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test
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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis
Journal Articles

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

J.-B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, F. Dulondel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021002.
Paper No: EP-17-1123
https://doi.org/10.1115/1.4042806
Published Online: March 1, 2019
View Article titled, Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements
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Topics: Manufacturing, Shear stress, Solder joints, Solders, Strain gages, Temperature, Thermomechanics, Cycles, Construction, Shear (Mechanics)
Journal Articles

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021001.
Paper No: EP-15-1109
https://doi.org/10.1115/1.4032880
Published Online: March 23, 2016
View Article titled, Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint
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Topics: Fatigue, Fracture (Materials), Shear (Mechanics), Shear stress, Temperature, Creep, Fracture (Process), Fatigue life, Cycles
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041014.
Paper No: EP-14-1027
https://doi.org/10.1115/1.4028333
Published Online: September 19, 2014
View Article titled, Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
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Topics: Sensors, Silicon, Stress, Bridges (Structures), Shear stress
Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
https://doi.org/10.1115/1.4006708
Published Online: July 18, 2012
View Article titled, Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
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Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress
Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
https://doi.org/10.1115/1.4005294
Published Online: December 21, 2011
View Article titled, Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change
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Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper
Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
https://doi.org/10.1115/1.3068318
Published Online: February 13, 2009
View Article titled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding
Journal Articles

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

E. Elsaadawy, H. Mortazavi, M. S. Hamed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031011.
https://doi.org/10.1115/1.2912182
Published Online: August 5, 2008
View Article titled, Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels
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Topics: Turbulence, Forced convection, Shear stress
Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
https://doi.org/10.1115/1.2227057
Published Online: August 7, 2005
View Article titled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip
Journal Articles

Interfacial Thermal Stresses in Trilayer Assemblies

H. R. Ghorbani, J. K. Spelt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 314–323.
https://doi.org/10.1115/1.1938205
Published Online: November 24, 2004
View Article titled, Interfacial Thermal Stresses in Trilayer Assemblies
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Topics: Shear (Mechanics), Shear stress, Stress, Manufacturing, Plane strain, Thermal stresses, Finite element analysis
Journal Articles

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

C. Q. Ru
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 141–146.
https://doi.org/10.1115/1.1481037
Published Online: July 26, 2002
View Article titled, Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited
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Topics: Shear stress, Stress, Thermal stresses, Shear (Mechanics), Differential equations, Displacement, Boundary-value problems
Journal Articles

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 69–76.
https://doi.org/10.1115/1.1400995
Published Online: May 2, 2002
View Article titled, Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board
Open the PDF for Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board in another window
Topics: Creep, Solder joints, Lead-free solders, Solders, Shear (Mechanics), Corners (Structural elements), Shear stress, Stress, Printed circuit board assemblies, Reliability
Journal Articles

Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures

Nazri Kamsah, Todd S. Gross, Igor I. Tsukrov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 12–21.
https://doi.org/10.1115/1.1402629
Published Online: March 8, 2001
View Article titled, Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures
Open the PDF for Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures in another window
Topics: Diffusion (Physics), Finite element analysis, Polymers, Stress, Copper, Thermal stresses, Shear stress
Journal Articles

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

F. Yang, I. Kao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 191–195.
https://doi.org/10.1115/1.2792683
Published Online: September 1, 1999
View Article titled, Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
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Topics: Abrasive machining, Semiconductor wafers, Stress, Abrasives, Manufacturing, Pressure, Shear stress, Slurries, Wire, Cutting
Journal Articles

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 218–224.
https://doi.org/10.1115/1.1362674
Published Online: July 6, 1999
View Article titled, Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
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Topics: Adhesives, Damage, Elastic analysis, Finite element analysis, Stress, Stress concentration, Electronic packaging, Shear stress, Stress singularity
Journal Articles

Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability

E. K. Buratynski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 221–228.
https://doi.org/10.1115/1.2792626
Published Online: September 1, 1998
View Article titled, Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability
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Topics: Die cutting, Lamination, Reliability, Shearing (Deformation), Solder joints, Fatigue life, Shear (Mechanics), Silicon, Stress, Temperature
Journal Articles

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

B. Nagaraj, M. Mahalingam
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 290–295.
https://doi.org/10.1115/1.2792635
Published Online: September 1, 1998
View Article titled, Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package
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Topics: Reliability, Temperature, Solders, Cycles, Finite element methods, Simulation, Creep, Failure, Simulation results, Ball-Grid-Array packaging
Journal Articles

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

J. Li, I. Kao, V. Prasad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 123–128.
https://doi.org/10.1115/1.2792595
Published Online: June 1, 1998
View Article titled, Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production
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Topics: Modeling, Semiconductor wafers, Stress, Wire, Particulate matter, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Journal Articles

Thermal Stresses in Layered Electronic Assemblies

Z. Q. Jiang, Y. Huang, A. Chandra
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 127–132.
https://doi.org/10.1115/1.2792218
Published Online: June 1, 1997
View Article titled, Thermal Stresses in Layered Electronic Assemblies
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Topics: Thermal stresses, Adhesives, Design, Stress, Electronic packages, Electronics, Euler-Bernoulli beam theory, Failure, Finite element analysis, Finite element methods