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Journal Articles

Transient Liquid Phase Bond Acceleration Using Copper Nanowires

Accepted Manuscript
John Harris, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
https://doi.org/10.1115/1.4066042
Published Online: July 20, 2024
View Article titled, Transient Liquid Phase Bond Acceleration Using Copper Nanowires
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Topics: Copper, Nanowires, Transients (Dynamics), Bonding, Solders, Intermetallic compounds, Temperature, Acoustic microscopy, Electroforming, Electronics
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031001.
Paper No: EP-22-1057
https://doi.org/10.1115/1.4056329
Published Online: December 9, 2022
View Article titled, Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging
Open the PDF for Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging in another window
Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength
Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
https://doi.org/10.1115/1.4055318
Published Online: September 28, 2022
View Article titled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life
Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041013.
Paper No: EP-21-1109
https://doi.org/10.1115/1.4053432
Published Online: February 1, 2022
View Article titled, Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
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Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Article titled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging

Ardalan Nasiri, Simon Ang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020902.
Paper No: EP-20-1060
https://doi.org/10.1115/1.4049292
Published Online: February 22, 2021
View Article titled, Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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Topics: Bonding, Ceramics, Electronic packaging, Hardening (Curing), High temperature, Shear strength, Temperature, Fracture (Materials), Fourier transform infrared spectroscopy, Aluminum
Journal Articles

Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint

Yang Liu, Zhao Li, Min Zhou, Xianghua Zeng, Fenglian Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031002.
Paper No: EP-20-1047
https://doi.org/10.1115/1.4049128
Published Online: January 19, 2021
View Article titled, Effect of Cu Foam and Ag-Coated Layer on the Microstructure and Mechanical Behavior of Nano-Ag Sintered Joint
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Topics: Bonding, Coating processes, Coatings, Composite materials, Mechanical behavior, Shear (Mechanics), Shear strength, Sintering, Fracture (Materials), Deformation
Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
https://doi.org/10.1115/1.4046341
Published Online: March 9, 2020
View Article titled, Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures
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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
View Article titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
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Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Journal Articles

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Sung Woo Ma, Chanho Shin, Young-Ho Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041004.
Paper No: EP-17-1044
https://doi.org/10.1115/1.4037474
Published Online: September 5, 2017
View Article titled, Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps
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Topics: Bonding, Contact resistance, Electrodiffusion, Shear strength, Temperature, Heating, Joules
Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2015, 137(4): 044501.
Paper No: EP-15-1062
https://doi.org/10.1115/1.4031750
Published Online: October 20, 2015
View Article titled, Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
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Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation
Journal Articles

Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process

Tzeng Yih-Fong, Chen Fu-Chen, Chen Chih-Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041004.
Paper No: EP-14-1080
https://doi.org/10.1115/1.4031471
Published Online: October 1, 2015
View Article titled, Multiple Quality Characteristics Optimization of Ball Grid Array Wire Bonding Process
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Topics: Ball-Grid-Array packaging, Optimization, Principal component analysis, Shear strength, Wire, Wire bonding, Design, Performance evaluation, Process design
Journal Articles

A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions

Bo Tao, Guanghua Wu, Zhouping Yin, Youlun Xiong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041008.
Paper No: EP-12-1112
https://doi.org/10.1115/1.4025840
Published Online: November 12, 2013
View Article titled, A Shear Strength Degradation Model for Anisotropic Conductive Adhesive Joints Under Hygrothermal Conditions
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Topics: Shear strength
Journal Articles

Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C

Chu-Hsuan Sha, Pin J. Wang, Wen P. Lin, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
https://doi.org/10.1115/1.4005295
Published Online: December 9, 2011
View Article titled, Solid State Bonding of Silver Foils to Metalized Alumina Substrates at 260°C
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Topics: Bonding, Diffusion bonding (Metals), Pressure, Silver, Shear (Mechanics), Shear strength, Solders, Atoms, Temperature
Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
https://doi.org/10.1115/1.4002900
Published Online: November 19, 2010
View Article titled, On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
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Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength
Journal Articles

Sub- 100   μ m SnAg Solder Bumping Technology and the Bump Reliability

Xiaoqin Lin, Le Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
https://doi.org/10.1115/1.2957333
Published Online: February 18, 2009
View Article titled, Sub- 100   μ m SnAg Solder Bumping Technology and the Bump Reliability
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Topics: Solders, Shear strength, Reliability, Tin
Journal Articles

The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition

M. K. Md Arshad, I. Ahmad, A. Jalar, G. Omar, U. Hashim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
https://doi.org/10.1115/1.2229223
Published Online: November 29, 2005
View Article titled, The Effects of Multiple Zincation Process on Aluminum Bond Pad Surface for Electroless Nickel Immersion Gold Deposition
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Topics: Adhesion, Aluminum, Atomic force microscopy, Nickel, Shear strength, Solders, Focused ion beams, Metallurgy, Scanning electron microscopy, X-rays
Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
View Article titled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion