1-7 of 7
Shades and shadows
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Warpage Analysis of Underfilled Wafers

Hai Ding, I. Charles Ume, Cheng Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 265–270.
https://doi.org/10.1115/1.1707036
Published Online: July 8, 2004
View Article titled, Warpage Analysis of Underfilled Wafers
Open the PDF for Warpage Analysis of Underfilled Wafers in another window
Topics: Finite element analysis, Semiconductor wafers, Shades and shadows, Warping, Young's modulus, Design, Regression analysis, Regression models
Journal Articles

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Anh X. H. Dang, I. Charles Ume, Swapan K. Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 86–91.
https://doi.org/10.1115/1.483152
Published Online: December 29, 1999
View Article titled, A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging
Open the PDF for A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging in another window
Topics: Warping, Coating processes, Packaging, Temperature, Shades and shadows, Stainless steel
Journal Articles

Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation

Y. Polsky, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 263–270.
https://doi.org/10.1115/1.2793850
Published Online: December 1, 1999
View Article titled, Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation
Open the PDF for Thermoelastic Modeling of a PWB With Simulated Circuit Traces Subjected to Infrared Reflow Soldering With Experimental Validation in another window
Topics: Circuits, Modeling, Printed circuit boards, Reflow soldering, Thermoelasticity, Warping, Copper, Elasticity, Lamination, Micromechanics (Engineering)
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
Open the PDF for Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect in another window
Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets

E. B. Zimmerman, G. T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1998, 120(2): 201–206.
https://doi.org/10.1115/1.2792621
Published Online: June 1, 1998
View Article titled, Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets
Open the PDF for Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets in another window
Topics: Temperature, Computer simulation, Electronics, Failure, Shades and shadows, Structures
Journal Articles

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

M. R. Stiteler, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 1–7.
https://doi.org/10.1115/1.2792196
Published Online: March 1, 1997
View Article titled, System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage
Open the PDF for System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage in another window
Topics: Printed circuit boards, Warping, Reflow soldering, Measurement systems, Shades and shadows, Soldering, Vehicles
Journal Articles

Thermomechanical Behavior of Multilayer Structures in Microelectronics

I. M. Daniel, T.-M. Wang, J. T. Gotro
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 11–15.
https://doi.org/10.1115/1.2904332
Published Online: March 1, 1990
View Article titled, Thermomechanical Behavior of Multilayer Structures in Microelectronics
Open the PDF for Thermomechanical Behavior of Multilayer Structures in Microelectronics in another window
Topics: Deformation, Epoxy adhesives, Epoxy resins, Glass, Hardening (Curing), Laminates, Lamination, Microelectronic devices, Polymerization, Residual stresses