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Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Article titled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
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Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles
Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
View Article titled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

M. T. North, C. T. Avedisian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 112–117.
https://doi.org/10.1115/1.2909290
Published Online: March 1, 1993
View Article titled, Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
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Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design