1-14 of 14
Porous materials
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor

Sanket Girhe, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021004.
Paper No: EP-20-1046
https://doi.org/10.1115/1.4048036
Published Online: September 3, 2020
View Article titled, Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor
Open the PDF for Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor in another window
Topics: Computer simulation, Flow (Dynamics), Pressure, Rotors, Porous materials, Simulation, Modeling
Journal Articles

A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

X. J. Yao, J. J. Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
https://doi.org/10.1115/1.4038391
Published Online: March 2, 2018
View Article titled, A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging
Open the PDF for A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging in another window
Topics: Flip-chip, Flow (Dynamics), Permeability, Porous materials, Packaging
Journal Articles

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041003.
Paper No: EP-13-1098
https://doi.org/10.1115/1.4026353
Published Online: September 19, 2014
View Article titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
Open the PDF for Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams in another window
Topics: Containers, Copper, Evaporation, Flux (Metallurgy), Foams (Chemistry), Heat, Heat losses, Porosity, Temperature, Ethanol
Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021008.
Paper No: EP-13-1129
https://doi.org/10.1115/1.4027420
Published Online: April 29, 2014
View Article titled, Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
Open the PDF for Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution in another window
Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature
Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
https://doi.org/10.1115/1.4002724
Published Online: November 24, 2010
View Article titled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
Open the PDF for The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks in another window
Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives
Journal Articles

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Nihad Dukhan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
https://doi.org/10.1115/1.3143947
Published Online: June 12, 2009
View Article titled, An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction
Open the PDF for An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction in another window
Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Temperature, Graphite, Metal foams, Thermal conductivity
Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
https://doi.org/10.1115/1.2229225
Published Online: September 23, 2005
View Article titled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
Open the PDF for Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection in another window
Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials
Journal Articles

Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles

Tzer-Ming Jeng, Sheng-Chung Tzeng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
https://doi.org/10.1115/1.2229220
Published Online: August 18, 2005
View Article titled, Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles
Open the PDF for Study of Flow and Heat Transfer Characteristics in Asymmetrically Heated Sintered Porous Heat Sinks With Periodical Baffles in another window
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Porous materials, Fluids, Reynolds number, Heat conduction
Journal Articles

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Chyi-Lang Lai, Wen-Bin Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
https://doi.org/10.1115/1.1649244
Published Online: July 8, 2004
View Article titled, A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps
Open the PDF for A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps in another window
Topics: Flow (Dynamics), Flow simulation, Permeability, Plates (structures), Porous materials, Simulation, Solders, Shapes, Cylinders
Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
https://doi.org/10.1115/1.1756149
Published Online: July 8, 2004
View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
Open the PDF for Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks in another window
Topics: Flow (Dynamics), Fluid dynamics, Heat sinks, Heat transfer, Modeling, Porous materials, Temperature distribution, Permeability, Pressure drop
Journal Articles

Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Y. H. Yan, J. M. Ochterbeck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
https://doi.org/10.1115/1.1569509
Published Online: June 10, 2003
View Article titled, Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator
Open the PDF for Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator in another window
Topics: Boundary-value problems, Flow (Dynamics), Fluids, Heat, Heat flux, Porous materials, Pressure, Steady state, Subcooling, Temperature
Journal Articles

The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

C. Cui, X. Y. Huang, C. Y. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
https://doi.org/10.1115/1.1287929
Published Online: July 11, 1999
View Article titled, The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel
Open the PDF for The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel in another window
Topics: Heat, Heat transfer, Permeability, Porous materials, Temperature, Flow (Dynamics), Heat flux, Heat sinks
Journal Articles

A Numerical Simulation of Conjugate Heat Transfer in an Electronic Package Formed by Embedded Discrete Heat Sources in Contact With a Porous Heat Sink

A. G. Fedorov, R. Viskanta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 8–16.
https://doi.org/10.1115/1.2792207
Published Online: March 1, 1997
View Article titled, A Numerical Simulation of Conjugate Heat Transfer in an Electronic Package Formed by Embedded Discrete Heat Sources in Contact With a Porous Heat Sink
Open the PDF for A Numerical Simulation of Conjugate Heat Transfer in an Electronic Package Formed by Embedded Discrete Heat Sources in Contact With a Porous Heat Sink in another window
Topics: Computer simulation, Electronic packages, Heat, Heat sinks, Heat transfer, Coolants, Flow (Dynamics), Porous materials
Journal Articles

Numerical Study of Forced Convection in a Partially Porous Channel With Discrete Heat Sources

H. A. Hadim, A. Bethancourt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 46–51.
https://doi.org/10.1115/1.2792066
Published Online: March 1, 1995
View Article titled, Numerical Study of Forced Convection in a Partially Porous Channel With Discrete Heat Sources
Open the PDF for Numerical Study of Forced Convection in a Partially Porous Channel With Discrete Heat Sources in another window
Topics: Forced convection, Heat, Heat transfer, Pressure drop, Porous materials, Flow (Dynamics), Fluids