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Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
https://doi.org/10.1115/1.4052231
Published Online: September 13, 2021
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder

B. L. Boyce, L. N. Brewer, M. K. Neilsen, M. J. Perricone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031009.
https://doi.org/10.1115/1.4004846
Published Online: September 23, 2011
View Article titled, On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder
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Topics: Solders, Temperature, Tin, Plasticity, Deformation, Creep
Journal Articles

Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder

David M. Pierce, Sheri D. Sheppard, Arlo F. Fossum, Paul T. Vianco, Mike K. Neilsen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011002.
https://doi.org/10.1115/1.2837513
Published Online: January 31, 2008
View Article titled, Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
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Topics: Constitutive equations, Creep, Damage, Finite element analysis, Plasticity, Simulation, Solders, Temperature, Stress, Fatigue
Journal Articles

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

Russell Whitenack, Chandra Desai, Mostafa Rassaian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 356–365.
https://doi.org/10.1115/1.2753981
Published Online: November 13, 2006
View Article titled, Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
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Topics: Cycles, Design, Electronic packaging, Failure, Plasticity, Shapes, Solders
Journal Articles

Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys

Juan Gomez, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
https://doi.org/10.1115/1.2721082
Published Online: October 4, 2006
View Article titled, Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys
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Topics: Alloys, Nanoindentation, Plasticity, Solders, Strain gradient, Microelectronic devices
Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 255–261.
https://doi.org/10.1115/1.1939007
Published Online: June 24, 2004
View Article titled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization
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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress
Journal Articles

Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy

R. W. Neu, D. T. Scott, M. W. Woodmansee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 238–246.
https://doi.org/10.1115/1.1371232
Published Online: December 12, 2000
View Article titled, Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy
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Topics: Alloys, Creep, Deformation, Solders, Temperature, Thermomechanics, Tin, Stress, Plasticity
Journal Articles

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Y.-L. Shen, W. Li, H. E. Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
https://doi.org/10.1115/1.1324673
Published Online: June 29, 2000
View Article titled, Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis
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Topics: Alloys, Deformation, Shear (Mechanics), Stress, Fatigue, Tin, Damage, Eutectic alloys, Cycles, Modeling
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems

Peter A. Engel, Kee Rong Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 314–321.
https://doi.org/10.1115/1.2905457
Published Online: September 1, 1992
View Article titled, Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems
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Topics: Solder joints, Thermal stresses, Stress, Cross section (Physics), Failure mechanisms, Finite element methods, Iterative methods, Plasticity, Pressure, Solders
Journal Articles

Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach

A. Dasgupta, C. Oyan, D. Barker, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 152–160.
https://doi.org/10.1115/1.2906412
Published Online: June 1, 1992
View Article titled, Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
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Topics: Creep, Fatigue, Solders, Temperature, Cycles, Damage, Finite element methods, Solder joints, Stress, Constitutive equations
Journal Articles

Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector

P. A. Engel, S. E. Nemier, M. D. Toda
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1989, 111(1): 9–15.
https://doi.org/10.1115/1.3226513
Published Online: March 1, 1989
View Article titled, Stress and Tolerance Analysis for Zero Insertion Force (ZIF) Connector
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Topics: Circuits, Deformation, Design, Finite element analysis, Friction, Plasticity, Probability, Springs, Stress, Stress analysis (Engineering)