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Journal Articles

Evaporative Wicking Phenomena on Nanotextured Surfaces

Duong Vy Le, Quang N. Pham, Jonggyu Lee, Shiwei Zhang, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031013.
Paper No: EP-18-1104
https://doi.org/10.1115/1.4044373
Published Online: September 19, 2019
View Article titled, Evaporative Wicking Phenomena on Nanotextured Surfaces
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Topics: Copper, Evaporation, Flux (Metallurgy), Heat, Heat flux, Permeability
Journal Articles

Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers

Dylan P. McNally, Ryan Lewis, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011005.
Paper No: EP-18-1064
https://doi.org/10.1115/1.4042255
Published Online: February 25, 2019
View Article titled, Characterization of Hybrid Wicking Structures for Flexible Vapor Chambers
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Topics: Columns (Structural), Flow (Dynamics), Permeability, Pressure, Vapors, Testing, Copper, Water
Journal Articles

A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

X. J. Yao, J. J. Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 011001.
Paper No: EP-17-1019
https://doi.org/10.1115/1.4038391
Published Online: March 2, 2018
View Article titled, A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging
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Topics: Flip-chip, Flow (Dynamics), Permeability, Porous materials, Packaging
Journal Articles

Modeling of Resin Flow in Reinforced Dielectric Prepregs

Pavel Simacek, Suresh G. Advani, Kossi Zonvide, Leonard W. Barrett
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
https://doi.org/10.1115/1.2837510
Published Online: April 15, 2008
View Article titled, Modeling of Resin Flow in Reinforced Dielectric Prepregs
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Topics: Copper, Flow (Dynamics), Pressure, Resins, Printed circuit boards, Permeability, Viscosity, Porosity
Journal Articles

A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps

Chyi-Lang Lai, Wen-Bin Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
https://doi.org/10.1115/1.1649244
Published Online: July 8, 2004
View Article titled, A Model for Underfill Viscous Flow Considering the Resistance Induced by Solder Bumps
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Topics: Flow (Dynamics), Flow simulation, Permeability, Plates (structures), Porous materials, Simulation, Solders, Shapes, Cylinders
Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
https://doi.org/10.1115/1.1756149
Published Online: July 8, 2004
View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
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Topics: Flow (Dynamics), Fluid dynamics, Heat sinks, Heat transfer, Modeling, Porous materials, Temperature distribution, Permeability, Pressure drop
Journal Articles

The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel

C. Cui, X. Y. Huang, C. Y. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 274–278.
https://doi.org/10.1115/1.1287929
Published Online: July 11, 1999
View Article titled, The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel
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Topics: Heat, Heat transfer, Permeability, Porous materials, Temperature, Flow (Dynamics), Heat flux, Heat sinks