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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
https://doi.org/10.1115/1.4051379
Published Online: September 15, 2021
View Article titled, A Hybrid Antenna in Package Solution Using FOWLP Technology
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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding
Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011009.
Paper No: EP-18-1065
https://doi.org/10.1115/1.4047475
Published Online: June 26, 2020
View Article titled, Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound
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Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives
Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021002.
Paper No: EP-19-1067
https://doi.org/10.1115/1.4045362
Published Online: February 3, 2020
View Article titled, Investigation of Strip Warpage Behavior in Wire Bonding Process
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Topics: Strips, Temperature, Warping, Molding, Assembly lines
Journal Articles

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011004.
Paper No: EP-19-1023
https://doi.org/10.1115/1.4044625
Published Online: September 19, 2019
View Article titled, Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging
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Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

Yowching Liaw, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031007.
Paper No: EP-16-1120
https://doi.org/10.1115/1.4037145
Published Online: July 10, 2017
View Article titled, The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds
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Topics: Fillers (Materials), Molding, Flow (Dynamics), Thermal conductivity, Water absorption, Bending strength
Journal Articles

Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package

Hu Guojun, Andrew A. O. Tay, Luan Jing-En, Ma Yiyi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
https://doi.org/10.1115/1.4001145
Published Online: March 19, 2010
View Article titled, Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
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Topics: Ball-Grid-Array packages, Delamination, Flip-chip, Flip-chip devices, Fracture (Materials), Shrinkage (Materials), Stress, Temperature, Epoxy resins, Molding
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
https://doi.org/10.1115/1.4000718
Published Online: March 4, 2010
View Article titled, Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process
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Topics: Electron mobility, Molding, Resins, Stress, Silicon
Journal Articles

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Guojun Hu, Jing-En Luan, Spencer Chew
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011010.
https://doi.org/10.1115/1.3068321
Published Online: February 13, 2009
View Article titled, Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis
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Topics: Epoxy resins, Finite element analysis, Molding, Shrinkage (Materials), Warping, Thermal expansion, Temperature, Fillers (Materials)
Journal Articles

An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process

Zone-Ching Lin, Chang-Cheng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
https://doi.org/10.1115/1.2429705
Published Online: September 20, 2006
View Article titled, An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process
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Topics: Molding, Stress, Temperature
Journal Articles

Moisture Absorption and Diffusion Characterization of Molding Compound

Xu Chen, Shufeng Zhao, Linda Zhai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
https://doi.org/10.1115/1.2065707
Published Online: January 21, 2005
View Article titled, Moisture Absorption and Diffusion Characterization of Molding Compound
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Topics: Absorption, Diffusion (Physics), Molding
Journal Articles

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
https://doi.org/10.1115/1.1938986
Published Online: December 2, 2004
View Article titled, Three-Dimensional Paddle Shift Modeling for IC Packaging
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Topics: Computation, Deflection, Flow (Dynamics), Fluid dynamics, Geometry, Integrated circuit packaging, Integrated circuits, Mesh generation, Modeling, Molding
Journal Articles

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

L. J. Ernst, G. Q. Zhang, K. M. B. Jansen, H. J. L. Bressers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
https://doi.org/10.1115/1.1604156
Published Online: December 15, 2003
View Article titled, Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
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Topics: Creep, Molding, Poisson ratio, Stress, Temperature, Relaxation (Physics), Packaging
Journal Articles

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
https://doi.org/10.1115/1.1604153
Published Online: December 15, 2003
View Article titled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
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Topics: Anisotropy, Molding, Packaging, Stress, Temperature, Viscoelasticity, Finite element analysis
Journal Articles

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

K. Ramakrishna, Fellow ASME, J. R. Trent
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 447–455.
https://doi.org/10.1115/1.1602710
Published Online: September 17, 2003
View Article titled, Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications
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Topics: Junctions, Molding, Printed circuit boards, Temperature, Thermal conductivity, Natural convection, Wire, Automotive industry, Emissivity
Journal Articles

Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance

Hung-Lung Lee, Shyang-Jye Chang, Sheng-Jye Hwang, Associate Professor,, Francis Su, S. K. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
https://doi.org/10.1115/1.1569957
Published Online: June 10, 2003
View Article titled, Computer-Aided Design of a TSOP II LOC Package Using Taguchi’s Parameter Design Method to Optimize Mold-Flow Balance
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Topics: Computer-aided design, Design, Design methodology, Flow (Dynamics), Taguchi methods, Noise factors, Molding, Packaging, Simulation, Manufacturing
Journal Articles

Study of P-V-T-C Relation of EMC

Yi-San Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
https://doi.org/10.1115/1.1498266
Published Online: December 12, 2002
View Article titled, Study of P-V-T-C Relation of EMC
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Topics: Differential scanning calorimetry, Molding, Pressure, Shrinkage (Materials), Temperature, Thermal expansion, Epoxy resins, Chemical kinetics, Viscosity