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Journal Articles

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
https://doi.org/10.1115/1.4028063
Published Online: July 24, 2014
View Article titled, Letter From the Editors
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Topics: Actuators, Biomedicine, Computers, Data centers, Design, Electronic packaging, Electronics, Energy / power systems, Engineering teachers, Feedback
Journal Articles

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
https://doi.org/10.1115/1.1756150
Published Online: July 8, 2004
View Article titled, Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
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Topics: Avionics, Creep, Cycles, Military systems, Solders, Temperature, Damage
Journal Articles

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 156–159.
https://doi.org/10.1115/1.2792608
Published Online: June 1, 1998
View Article titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes
Journal Articles

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Sidharth, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 244–249.
https://doi.org/10.1115/1.2792159
Published Online: December 1, 1996
View Article titled, Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
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Topics: Corners (Structural elements), Fatigue life, Vibration, Stress, Displacement, Finite element analysis, Avionics, Boundary-value problems, Electronic packages, Electronic packaging
Journal Articles

A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics

Peter E. Jimenez, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 220–229.
https://doi.org/10.1115/1.2905689
Published Online: September 1, 1994
View Article titled, A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics
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Topics: Aircraft, Avionics, Coolants, Flow (Dynamics), Pressure drop, Subcooling, Cooling, Heat, Military systems, Printed circuit boards
Journal Articles

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

J. G. Stack, M. S. Acarlar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 258–262.
https://doi.org/10.1115/1.2905404
Published Online: September 1, 1991
View Article titled, Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package
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Topics: Energy dissipation, Finite element analysis, Heat transfer, Military systems, Packaging, Reliability, Stress, Temperature, Thermal management, Thermal stresses
Journal Articles

Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing

H. K. Charles, Jr., G. V. Clatterbaugh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 135–146.
https://doi.org/10.1115/1.2904354
Published Online: June 1, 1990
View Article titled, Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing
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Topics: Design, Finite element analysis, Modeling, Reliability, Solder joints, Testing, Fatigue life, Stress, Fracture toughness, Temperature
Journal Articles

The Military Specifications for Hybrid Microelectronics and How They Influence Future Hybrid Technology

W. J. Spears
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 303–309.
https://doi.org/10.1115/1.3226552
Published Online: December 1, 1989
View Article titled, The Military Specifications for Hybrid Microelectronics and How They Influence Future Hybrid Technology
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Topics: Microelectronic devices, Military systems, Design, Reliability