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Journal Articles

Viability of Cryogenic Cooling to Reduce Processor Power Consumption

Alec Nordlund, Matthew Harrison, Joshua Gess
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041101.
Paper No: EP-21-1034
https://doi.org/10.1115/1.4051752
Published Online: August 9, 2021
View Article titled, Viability of Cryogenic Cooling to Reduce Processor Power Consumption
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Topics: Coolants, Cooling, Energy consumption, Flow (Dynamics), Nitrogen, Temperature, Design, Leakage, Solenoids, Thermal stability
Journal Articles

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Yuanchen Hu, Md Obaidul Hossen, Zhimin Wan, Muhannad S. Bakir, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031007.
Paper No: EP-20-1045
https://doi.org/10.1115/1.4049814
Published Online: February 19, 2021
View Article titled, Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Cooling, Integrated circuits, Leakage, Simulation, Temperature, Transients (Dynamics), Fins, Steady state, Heat
Journal Articles

Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements

Ismail Turkmen, Cem Ahmet Mercan, Hamza Salih Erden
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031116.
Paper No: EP-20-1018
https://doi.org/10.1115/1.4047845
Published Online: August 5, 2020
View Article titled, Experimental and Computational Investigations of the Thermal Environment in a Small Operational Data Center for Potential Energy Efficiency Improvements
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Topics: Air flow, Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Temperature, Tiles, Potential energy, Stress, Leakage
Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
https://doi.org/10.1115/1.4047469
Published Online: June 23, 2020
View Article titled, Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization
Open the PDF for Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization in another window
Topics: Data centers, Dust, Leakage, Particulate matter, Sensors
Journal Articles

Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer

Hongfeng Jia, Huabin Yu, Zhongjie Ren, Chong Xing, Zhongling Liu, Yang Kang, Haiding Sun
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031115.
Paper No: EP-20-1017
https://doi.org/10.1115/1.4047286
Published Online: June 8, 2020
View Article titled, Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer
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Topics: Electrons, Light-emitting diodes, Leakage
Journal Articles

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031108.
Paper No: EP-19-1132
https://doi.org/10.1115/1.4046934
Published Online: May 4, 2020
View Article titled, Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region
Open the PDF for Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region in another window
Topics: Electric fields, Electrons, Gallium nitride, Indium gallium nitride, Light-emitting diodes, Polarization (Electricity), Polarization (Light), Polarization (Waves), Quantum wells, Leakage
Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
https://doi.org/10.1115/1.4042983
Published Online: April 10, 2019
View Article titled, Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature
Journal Articles

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010907.
Paper No: EP-17-1109
https://doi.org/10.1115/1.4039028
Published Online: March 2, 2018
View Article titled, Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles
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Topics: Air flow, Design, Leakage, Tiles, Temperature, Computational fluid dynamics, Simulation, Flow (Dynamics), Pressure
Journal Articles

Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment

Sami A. Alkharabsheh, Bahgat G. Sammakia, Saurabh K. Shrivastava
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
https://doi.org/10.1115/1.4029344
Published Online: June 1, 2015
View Article titled, Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment
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Topics: Air flow, Calibration, Computational fluid dynamics, Containment, Data centers, Flow (Dynamics), Leakage, Stress, Temperature, Tiles
Journal Articles

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031015.
Paper No: EP-13-1050
https://doi.org/10.1115/1.4028013
Published Online: July 24, 2014
View Article titled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding
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Topics: Bonding, Design, Glass, Leakage, Microchannels, Silicon, Cavities, Theoretical analysis, Pressure sensors, Temperature
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash, Niru Kumari, Tahir Cader
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041009.
https://doi.org/10.1115/1.4007744
Published Online: November 26, 2012
View Article titled, From Chip to Cooling Tower Data Center Modeling: Chip Leakage Power and Its Impact on Cooling Infrastructure Energy Efficiency
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Topics: Cooling, Data centers, Heat sinks, Leakage, Temperature, Energy consumption, Heat
Journal Articles

Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes

Chung-Feng Jeffrey Kuo, Hui-Ta Chen, Te-Li Su, Jr-Da Huang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041006.
https://doi.org/10.1115/1.4002727
Published Online: November 24, 2010
View Article titled, Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes
Open the PDF for Multi-Objective Optimization of Thermo-Ultrasonic Flip-Chip Bonding Process for High-Brightness Light Emitting Diodes in another window
Topics: Bonding, Flip-chip, Light-emitting diodes, Leakage, Taguchi methods
Journal Articles

Measurement of Leak Rate for MEMS Vacuum Packaging

Zhiyin Gan, Dexiu Huang, Xuefang Wang, Dong Lin, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041001.
https://doi.org/10.1115/1.3144148
Published Online: October 16, 2009
View Article titled, Measurement of Leak Rate for MEMS Vacuum Packaging
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Topics: Leakage, Packaging, Vacuum, Pressure, Flow (Dynamics)
Journal Articles

Lifetime Estimation of Moems Devices

T. Bar-Kohany, A. Stern
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 144–148.
https://doi.org/10.1115/1.2721085
Published Online: June 13, 2006
View Article titled, Lifetime Estimation of Moems Devices
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Topics: Cavities, Flow (Dynamics), Leakage, Microoptoelectromechanical systems, Pressure, Water, Electrical conductance
Journal Articles

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

M. Baris Dogruoz, Alfonso Ortega, Russell V. Westphal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 53–60.
https://doi.org/10.1115/1.2159009
Published Online: July 30, 2005
View Article titled, A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks
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Topics: Flow (Dynamics), Heat sinks, Leakage, Heat transfer, Pressure drop
Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 294–301.
https://doi.org/10.1115/1.1571076
Published Online: June 10, 2003
View Article titled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
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Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging
Journal Articles

Reliable Ceramic Window Design for Electronic Devices

Hsien-Yang Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 349–352.
https://doi.org/10.1115/1.2905462
Published Online: September 1, 1992
View Article titled, Reliable Ceramic Window Design for Electronic Devices
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Topics: Ceramics, Design, Fracture (Materials), Vacuum, Leakage, Traveling waves, Approximation, Fracture mechanics, Heating, Plates (structures)
Journal Articles

Closing of Surface Flaws Under Compressive Loading

W. E. Warren, D. E. Amos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 63–67.
https://doi.org/10.1115/1.2905368
Published Online: March 1, 1991
View Article titled, Closing of Surface Flaws Under Compressive Loading
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Topics: Deformation, Displacement, Electronic components, Leakage, Seals, Stress
Journal Articles

Finite Element Modeling for Optimizing Hermetic Package Reliability

J. H. Lau, L. B. Lian-Mueller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 255–260.
https://doi.org/10.1115/1.3226544
Published Online: December 1, 1989
View Article titled, Finite Element Modeling for Optimizing Hermetic Package Reliability
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Topics: Finite element analysis, Modeling, Reliability, Design, Microwaves, Construction, Finite element methods, Finite element model, Leakage, Thermal stresses