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Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Article titled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
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Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Article titled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique

Zong-Tao Li, Jia-Yong Liang, Jia-Sheng Li, Jie-Xin Li, Yong Tang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021002.
Paper No: EP-20-1041
https://doi.org/10.1115/1.4048034
Published Online: August 27, 2020
View Article titled, Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique
Open the PDF for Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique in another window
Topics: Boron, Electromagnetic scattering, Light-emitting diodes, Nanoparticles, Radiation scattering, Reflection, Scattering (Physics), Quantum dots, Packaging, Geometry
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
View Article titled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Journal Articles

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Gunjan Agarwal, Thomas Kazior, Thomas Kenny, Dana Weinstein
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
https://doi.org/10.1115/1.4035064
Published Online: November 10, 2016
View Article titled, Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling
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Topics: Cooling, Flow (Dynamics), Fluids, Gallium nitride, Microchannels, Microfluidics, Silicon, Temperature, Heat, Geometry
Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
https://doi.org/10.1115/1.4032493
Published Online: March 10, 2016
View Article titled, Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping
Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041003.
Paper No: EP-14-1099
https://doi.org/10.1115/1.4031523
Published Online: September 25, 2015
View Article titled, Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
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Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds
Journal Articles

Design of Thermoelectric Modules for High Heat Flux Cooling

Ram Ranjan, Joseph E. Turney, Charles E. Lents, Virginia H. Faustino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041001.
Paper No: EP-13-1073
https://doi.org/10.1115/1.4028118
Published Online: September 19, 2014
View Article titled, Design of Thermoelectric Modules for High Heat Flux Cooling
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Topics: Cooling, Design, Heat, Heat flux, Packing (Shipments), Packings (Cushioning), Temperature, Geometry, Thermal resistance, Thermoelectric coolers
Journal Articles

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031013.
Paper No: EP-13-1138
https://doi.org/10.1115/1.4027728
Published Online: June 10, 2014
View Article titled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
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Topics: Design, Flow (Dynamics), Geometry, Heat transfer, Optimization, Reynolds number, Thermal resistance, Vortices, Wavelength, Degrees of freedom
Journal Articles

Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

Giulio Lorenzini, Cesare Biserni, Emanuel da Silva Diaz Estrada, Elizaldo Domingues Dos Santos, Liércio André Isoldi, Luiz Alberto Oliveira Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031011.
Paper No: EP-14-1022
https://doi.org/10.1115/1.4027421
Published Online: May 12, 2014
View Article titled, Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities
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Topics: Cavities, Degrees of freedom, Design, Genetic algorithms, Optimization, Shapes, Temperature, Simulation, Geometry
Journal Articles

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Maxat N. Touzelbaev, Josef Miler, Yizhang Yang, Gamal Refai-Ahmed, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031001.
Paper No: EP-12-1066
https://doi.org/10.1115/1.4024747
Published Online: July 24, 2013
View Article titled, High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
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Topics: Filters, Modeling, Temperature, Thermal management, Transfer functions, Transients (Dynamics), Geometry, Filtration
Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
https://doi.org/10.1115/1.4007258
Published Online: October 30, 2012
View Article titled, Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications
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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives
Journal Articles

Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium

G. Lorenzini, C. Biserni, L. A. Isoldi, E. D. dos Santos, L. A. O. Rocha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041008.
https://doi.org/10.1115/1.4005296
Published Online: December 9, 2011
View Article titled, Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
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Topics: Cavities, Design, Geometry, Optimization, Shapes, Thermal resistance, Degrees of freedom
Journal Articles

Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits

D. Bhate, G. Subbarayan, J. Zhao, V. Gupta, D. Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
https://doi.org/10.1115/1.4000208
Published Online: November 12, 2009
View Article titled, Improved Solder Joint Fatigue Models Through Reduced Geometry Dependence of Empirical Fits
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Topics: Geometry, Solder joints, Solders, Failure, Fatigue, Alloys, Energy dissipation
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Article titled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
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Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

X. L. Xie, W. Q. Tao, Y. L. He
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
https://doi.org/10.1115/1.2753887
Published Online: December 13, 2006
View Article titled, Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
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Topics: Cooling, Heat flux, Heat sinks, Heat transfer, Pressure drop, Temperature, Thermal resistance, Turbulence, Wall thickness, Water
Journal Articles

Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling

Carlos Silva, Egidio Marotta, Leroy Fletcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 157–166.
https://doi.org/10.1115/1.2721087
Published Online: July 3, 2006
View Article titled, Flow Structure and Enhanced Heat Transfer in Channel Flow With Dimpled Surfaces: Application to Heat Sinks in Microelectronic Cooling
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Topics: Channel flow, Computer simulation, Cooling, Design, Flow (Dynamics), Friction, Heat sinks, Heat transfer, Reynolds number, Geometry
Journal Articles

The Role of Fin Geometry in Heat Sink Performance

W. A. Khan, J. R. Culham, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 324–330.
https://doi.org/10.1115/1.2351896
Published Online: February 24, 2006
View Article titled, The Role of Fin Geometry in Heat Sink Performance
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Topics: Drag (Fluid dynamics), Entropy, Geometry, Heat sinks, Heat transfer, Reynolds number, Thermal resistance, Heat transfer coefficients, Viscosity
Journal Articles

Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications

Jaeseon Lee, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 30–37.
https://doi.org/10.1115/1.2159006
Published Online: June 17, 2005
View Article titled, Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications
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Topics: Compressors, Cooling, Heat, Heat sinks, Microchannels, Pressure drop, Refrigeration, Temperature, Compression, Heat transfer coefficients