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Journal Articles

On-Chip Power Generation Using Ultrathin Thermoelectric Generators

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011005.
Paper No: EP-14-1012
https://doi.org/10.1115/1.4027995
Published Online: October 6, 2014
View Article titled, On-Chip Power Generation Using Ultrathin Thermoelectric Generators
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Topics: Electronic packages, Energy generation, Generators, Heat flux, Junctions, Stress, Temperature, Waste heat, Transients (Dynamics)
Journal Articles

Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators

Xinqiang Xu, Siyi Zhou, Mark M. Meyers, Bahgat G. Sammakia, Bruce T. Murray
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041004.
Paper No: EP-13-1103
https://doi.org/10.1115/1.4028060
Published Online: September 19, 2014
View Article titled, Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators
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Topics: Electrical efficiency, Flow (Dynamics), Generators, Temperature, Thermal efficiency, Water, Heat, Solar energy
Journal Articles

On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator

Wuwei Feng, Qingfeng Meng, Youbo Xie, Hong Fan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
https://doi.org/10.1115/1.4002900
Published Online: November 19, 2010
View Article titled, On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator
Open the PDF for On-Line Quality Detection of Ultrasonic Wire Bonding via Refining Analysis of Electrical Signal From Ultrasonic Generator in another window
Topics: Bonding, Feature extraction, Signals, Wire bonding, Generators, Principal component analysis, Wire, Damping, Artificial neural networks, Shear strength
Journal Articles

Local Heat Transfer Characteristics in Simulated Electronic Modules

Seong-Yeon Yoo, Jong-Hark Park, Min-Ho Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 362–368.
https://doi.org/10.1115/1.1602478
Published Online: September 17, 2003
View Article titled, Local Heat Transfer Characteristics in Simulated Electronic Modules
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Topics: Generators, Heat transfer, Vortices, Flow (Dynamics), Heat transfer coefficients, Wakes, Forced convection
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Article titled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Random Change of Vibration Modes in Thermosonic Bonding

S.-Y. Kang, K. Chuang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 253–258.
https://doi.org/10.1115/1.2792630
Published Online: September 1, 1998
View Article titled, Random Change of Vibration Modes in Thermosonic Bonding
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Topics: Bonding, Vibration, Friction, End effectors, Excitation, Flip-chip assemblies, Generators, Modal analysis, Process control, Resonance
Journal Articles

Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection

S. V. Garimella, D. J. Schlitz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 410–415.
https://doi.org/10.1115/1.2909350
Published Online: December 1, 1993
View Article titled, Reducing Inter-Chip Temperature Differences in Computers Using Vortex Generators in Forced Convection
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Topics: Computers, Forced convection, Generators, Temperature, Vortices, Flow (Dynamics), Pressure drop, Reynolds number, Coolants, Cooling