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Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Article titled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
https://doi.org/10.1115/1.4055318
Published Online: September 28, 2022
View Article titled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
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Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Article titled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041001.
Paper No: EP-20-1010
https://doi.org/10.1115/1.4048109
Published Online: August 27, 2020
View Article titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads
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Topics: Fatigue life, Shear (Mechanics), Stress, Fatigue, Solder joints, Cycles, Fatigue testing, Solders
Journal Articles

Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity

Xiaoguang Huang, Zhiqiang Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011013.
Paper No: EP-19-1068
https://doi.org/10.1115/1.4045255
Published Online: November 14, 2019
View Article titled, Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity
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Topics: Fatigue, Stress, Fatigue testing, Solders, Cycles
Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
https://doi.org/10.1115/1.4006708
Published Online: July 18, 2012
View Article titled, Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
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Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress
Journal Articles

Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves

Ken-ichi Ohguchi, Katsuhiko Sasaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041010.
https://doi.org/10.1115/1.4002911
Published Online: December 3, 2010
View Article titled, Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves
Open the PDF for Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves in another window
Topics: Creep, Lead-free solders, Fatigue life, Compression, Fatigue testing, Waves, Stress
Journal Articles

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

John H. L. Pang, F. X. Che
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
https://doi.org/10.1115/1.2809442
Published Online: August 27, 2007
View Article titled, Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
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Topics: Cycles, Density, Displacement, Fatigue, Fatigue testing, Finishes, Finite element analysis, High temperature, Lead-free solders, Manufacturing
Journal Articles

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
https://doi.org/10.1115/1.2386242
Published Online: October 4, 2006
View Article titled, Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
Open the PDF for Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials in another window
Topics: Delamination, Fatigue, Fatigue testing, Fracture (Materials), Stress, Thermomechanics, Temperature, Experimental characterization, Fracture (Process), Fracture toughness
Journal Articles

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Tae-Sang Park, Soon-Bok Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
https://doi.org/10.1115/1.1871192
Published Online: May 26, 2004
View Article titled, Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
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Topics: Ball-Grid-Array packaging, Displacement, Fatigue life, Fatigue testing, Low cycle fatigue, Solder joints, Solders, Stress, Testing, Tin
Journal Articles

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Ki-Ju Kang, Seon-Ho Choi, Tae-Sung Bae
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 385–390.
https://doi.org/10.1115/1.1510863
Published Online: December 12, 2002
View Article titled, Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints
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Topics: Fatigue cracks, Fracture (Materials), Solder joints, Solders, Stress, Fatigue testing, Intermetallic compounds
Journal Articles

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 403–410.
https://doi.org/10.1115/1.1512294
Published Online: December 12, 2002
View Article titled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
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Topics: Creep, Fatigue, Fatigue testing, Sealing (Process), Solders, Stress, Switches, Density, Cycles, Finite element analysis
Journal Articles

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending

S. Shetty, V. Lehtinen, A. Dasgupta, V. Halkola, T. Reinikainen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 302–308.
https://doi.org/10.1115/1.1362673
Published Online: March 25, 2000
View Article titled, Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending
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Topics: Cycles, Failure, Fatigue, Fatigue testing, Finite element analysis, Solder joints, Stress, Durability, Fatigue life
Journal Articles

The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies

Y. P. Wu, P. L. Tu, Yan C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 284–289.
https://doi.org/10.1115/1.1371782
Published Online: July 7, 1999
View Article titled, The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
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Topics: Fatigue life, Reliability, Solder joints, Solders, Thermal shock, Ball-Grid-Array packaging, Vibration, Ceramics, Nitrogen, Cycles
Journal Articles

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 372–378.
https://doi.org/10.1115/1.2792649
Published Online: December 1, 1998
View Article titled, A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces
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Topics: Fatigue testing, Polymers, Thermomechanics, Fracture (Materials), Displacement, Cycles, Fatigue, Cantilever beams, Delamination, Failure
Journal Articles

Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly

J. Seyyedi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 305–311.
https://doi.org/10.1115/1.2909333
Published Online: September 1, 1993
View Article titled, Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly
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Topics: Alloys, Fatigue, Low temperature, Manufacturing, Solders, Bearings, Failure mechanisms, Fatigue testing, Solder joints
Journal Articles

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Yi-Hsin Pao, Ratan Govila, Scott Badgley, Edward Jih
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 1–8.
https://doi.org/10.1115/1.2909296
Published Online: March 1, 1993
View Article titled, An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints
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Topics: Fatigue, Finite element analysis, Fracture (Materials), Solder joints, Solders, Stress, Creep, Alloys, Cycles, Failure
Journal Articles

Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading

S.-M. Lee, D. S. Stone
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1992, 114(2): 118–121.
https://doi.org/10.1115/1.2906407
Published Online: June 1, 1992
View Article titled, Deformation and Fracture of Pb-Sn-Eutectic Under Tensile and Fatigue Loading
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Topics: Deformation, Fatigue, Fracture (Materials), Tin, Failure, Cavitation, Displacement, Fatigue testing, Grain boundaries, Compression