1-14 of 14
Equilibrium (Physics)
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction

Cheng Chen, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041008.
Paper No: EP-16-1053
https://doi.org/10.1115/1.4034856
Published Online: October 20, 2016
View Article titled, A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction
Open the PDF for A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction in another window
Topics: Diffusion (Physics), Heat conduction, Lattice Boltzmann methods, Phonons, Silicon, Temperature, Thermal conductivity, Density, Heat, Equilibrium (Physics)
Journal Articles

Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

Sheikh Mohammad Shavik, Mohammad Nasim Hasan, A. K. M. Monjur Morshed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010904.
Paper No: EP-15-1086
https://doi.org/10.1115/1.4032463
Published Online: March 10, 2016
View Article titled, Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions
Open the PDF for Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions in another window
Topics: Boiling, Explosives, Molecular dynamics, Simulation, Temperature, Vapors, Wetting, Density, Equilibrium (Physics), Heat flux
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Article titled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
Open the PDF for Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering in another window
Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage

Mahidhar Rayasam, Terrace B. Thompson, Ganesh Subbarayan, C. Gurumurthy, J. R. Wilcox
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 184–191.
https://doi.org/10.1115/1.2227058
Published Online: August 27, 2005
View Article titled, A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage
Open the PDF for A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage in another window
Topics: Shapes, Solder joints, Solders, Warping, Equilibrium (Physics)
Journal Articles

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Jang-hi Im, Mem. ASME, Edward O. Shaffer, II, Theodore Stokich,, Jr., Andrew Strandjord, Jack Hetzner, James Curphy, Cheryl Karas, Greg Meyers, David Hawn, Ashok Chakrabarti, Steve Froelicher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
https://doi.org/10.1115/1.483128
Published Online: October 20, 1999
View Article titled, On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications
Open the PDF for On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications in another window
Topics: Adhesion, Atomic force microscopy, Coatings, Polymers, Reliability, Thermal stability, Thin films, Fracture (Process), Fracture (Materials), Silicon
Journal Articles

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 281–287.
https://doi.org/10.1115/1.2792250
Published Online: December 1, 1997
View Article titled, Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading
Open the PDF for Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading in another window
Topics: Algebra, Equilibrium (Physics), Finite element analysis, Microelectronic devices, Stress, Stress analysis (Engineering), Stress concentration, Strips
Journal Articles

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

S. A. Taylor, K. Chen, R. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 85–88.
https://doi.org/10.1115/1.2792224
Published Online: June 1, 1997
View Article titled, Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
Open the PDF for Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs) in another window
Topics: Acoustics, Computers, Cracking (Materials), Equilibrium (Physics), Fracture (Process), Heat, Heating, High temperature, Lumber, Microscopy
Journal Articles

Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT

T. S. Lee, T. P. Choi, C. D. Yoo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 119–126.
https://doi.org/10.1115/1.2792214
Published Online: June 1, 1997
View Article titled, Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT
Open the PDF for Finite Element Modeling of Three-Dimensional Solder Joint Geometry in SMT in another window
Topics: Finite element analysis, Geometry, Modeling, Solder joints, Bricks, Electronic packaging, Equilibrium (Physics), Shapes, Soldering, Surface mount packaging
Journal Articles

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 174–183.
https://doi.org/10.1115/1.2792149
Published Online: September 1, 1996
View Article titled, Dynamic Aspects of Wetting Balance Tests
Open the PDF for Dynamic Aspects of Wetting Balance Tests in another window
Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress
Journal Articles

Computer Simulation of Solder Bridging Phenomena

T. J. Singler, Xu Zhang, K. A. Brakke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 122–126.
https://doi.org/10.1115/1.2792141
Published Online: September 1, 1996
View Article titled, Computer Simulation of Solder Bridging Phenomena
Open the PDF for Computer Simulation of Solder Bridging Phenomena in another window
Topics: Computer simulation, Solders, Bridges (Structures), Liquid metals, Stability, Equilibrium (Physics)
Journal Articles

Finite Element Method for Predicting Equilibrium Shapes of Solder Joints

N. J. Nigro, S. M. Heinrich, A. F. Elkouh, X. Zou, R. Fournelle, Ping S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 141–146.
https://doi.org/10.1115/1.2909309
Published Online: June 1, 1993
View Article titled, Finite Element Method for Predicting Equilibrium Shapes of Solder Joints
Open the PDF for Finite Element Method for Predicting Equilibrium Shapes of Solder Joints in another window
Topics: Equilibrium (Physics), Finite element methods, Shapes, Solder joints, Finite element analysis, Potential energy, Interpolation, Stress, Surface mount packaging, Theorems (Mathematics)
Journal Articles

Shape and Force Relationships for Molten Axisymmetric Solder Connections

R. H. Katyl, W. T. Pimbley
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 336–341.
https://doi.org/10.1115/1.2905460
Published Online: September 1, 1992
View Article titled, Shape and Force Relationships for Molten Axisymmetric Solder Connections
Open the PDF for Shape and Force Relationships for Molten Axisymmetric Solder Connections in another window
Topics: Shapes, Solders, Collapse, Computational methods, Equilibrium (Physics), Gravity (Force), Surface tension
Journal Articles

Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions

Wan-Lee Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 68–75.
https://doi.org/10.1115/1.2905369
Published Online: March 1, 1991
View Article titled, Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions
Open the PDF for Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions in another window
Topics: Stress, Thermal stresses, Boundary-value problems, Degrees of freedom, Eigenfunctions, Equilibrium (Physics), Finite element analysis, Polynomials, Temperature, Traction
Journal Articles

Analysis of Insertion Force in Elastic/Plastic Mating

S. E. Yamada, H. Ueno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 192–197.
https://doi.org/10.1115/1.2904366
Published Online: September 1, 1990
View Article titled, Analysis of Insertion Force in Elastic/Plastic Mating
Open the PDF for Analysis of Insertion Force in Elastic/Plastic Mating in another window
Topics: Deformation, Electronic systems, Equilibrium (Physics), Friction, Simulation