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Journal Articles

Electroplated Connections Between Carbon Fiber and Nickel

Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011009.
Paper No: EP-16-1045
https://doi.org/10.1115/1.4035703
Published Online: January 27, 2017
View Article titled, Electroplated Connections Between Carbon Fiber and Nickel
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Topics: Carbon fibers, Nickel, Metals, Carbon, Solders, Batteries, Electroplating
Journal Articles

Development of G-Helix Structure as Off-Chip Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
https://doi.org/10.1115/1.1756148
Published Online: July 8, 2004
View Article titled, Development of G-Helix Structure as Off-Chip Interconnect
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Topics: Design, Displacement, Geometry, Manufacturing, Optimization, Packaging, Reliability, Solders, Stress, Thermomechanics
Journal Articles

Cleaning and Reflow of Pb-Sn C4 Solder Bumps

Caroline S. Lee, Doug C. Crafts, T. W. Eagar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 281–287.
https://doi.org/10.1115/1.2792106
Published Online: December 1, 1995
View Article titled, Cleaning and Reflow of Pb-Sn C4 Solder Bumps
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Topics: Solders, Tin, Etching, Corrosion, Diffusion (Physics), Electroplating, Metallurgy, Reflow soldering, Sulfur, Water