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Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Article titled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
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Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Feifei Yan, Laili Wang, Yongmei Gan, Kaixuan Li, Boya Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031016.
Paper No: EP-21-1168
https://doi.org/10.1115/1.4053891
Published Online: March 11, 2022
View Article titled, A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
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Topics: Ceramics, Electric fields, Electrodes, Silicones, Insulation
Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
https://doi.org/10.1115/1.4047459
Published Online: June 23, 2020
View Article titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
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Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields
Journal Articles

Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications

Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
https://doi.org/10.1115/1.4046764
Published Online: April 17, 2020
View Article titled, Rapid Anneal-Free Welding of Cu Nanowires Network by Ultraviolet Light Irradiation for Transparent Electrodes in Optoelectronic Applications
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Topics: Electrodes, Irradiation (Radiation exposure), Nanowires, Transparency, Ultraviolet radiation, Light-emitting diodes, Welding
Journal Articles

Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

Stephen H. Taylor, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
https://doi.org/10.1115/1.4028075
Published Online: September 19, 2014
View Article titled, Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
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Topics: Capacitance, Electrodes, Junctions, Network models, Sensors
Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
https://doi.org/10.1115/1.4026878
Published Online: September 19, 2014
View Article titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation
Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020908.
https://doi.org/10.1115/1.4004095
Published Online: July 1, 2011
View Article titled, Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
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Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration
Journal Articles

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
https://doi.org/10.1115/1.4004220
Published Online: June 17, 2011
View Article titled, A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
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Topics: Carbon nanotubes, Electrodes
Journal Articles

Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

Y. Sungtaek Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
https://doi.org/10.1115/1.4002896
Published Online: November 23, 2010
View Article titled, Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling
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Topics: Cooling, Electrodes, Temperature, Thermal conductivity, Manufacturing
Journal Articles

Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

Yongho “Sungtaek” Ju
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 109–114.
https://doi.org/10.1115/1.2165215
Published Online: December 5, 2005
View Article titled, Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications
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Topics: Electrodes, Heat, Junctions, Thermal resistance, Tunnels, Spintronics, Electrons, Heat conduction, Tunnel construction, Phonons
Journal Articles

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
https://doi.org/10.1115/1.1604151
Published Online: December 15, 2003
View Article titled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation
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Topics: Capacitors, Ceramics, Computation, Computer simulation, Cooling, Finite element analysis, Residual stresses, Simulation, Sintering, Stress
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Wei Qin, Ira M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 212–219.
https://doi.org/10.1115/1.2905688
Published Online: September 1, 1994
View Article titled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process
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Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat
Journal Articles

Time-Dependent Ductility of Electro-Deposited Copper

Yoshiki Oshida, P. C. Chen, J. D. Reid, T. Nishihara
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 448–454.
https://doi.org/10.1115/1.2905479
Published Online: December 1, 1992
View Article titled, Time-Dependent Ductility of Electro-Deposited Copper
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Topics: Copper, Ductility, Temperature, Annealing, Current density, Dislocation density, Electrodes, Electrons, Film thickness, Grain size