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Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
https://doi.org/10.1115/1.4062530
Published Online: June 23, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation
Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Article titled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis
Journal Articles

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
https://doi.org/10.1115/1.4047497
Published Online: June 26, 2020
View Article titled, System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials
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Topics: Cooling, Electronics, Heat, Phase change materials, Reliability, Temperature, Thermal management, Heat sinks, Design, Convection
Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010909.
Paper No: EP-15-1097
https://doi.org/10.1115/1.4032348
Published Online: March 11, 2016
View Article titled, Modeling Thermal Microspreading Resistance in Via Arrays
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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model
Journal Articles

Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation

Noris Gallandat, Danielle Hesse, J. Rhett Mayor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010908.
Paper No: EP-15-1096
https://doi.org/10.1115/1.4032347
Published Online: March 10, 2016
View Article titled, Microfeature Heat Exchanger Using Variable-Density Arrays for Near-Isothermal Cold-Plate Operation
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Topics: Convection, Density, Flow (Dynamics), Heat, Heat exchangers, Heat transfer, Hydrofoil, Pressure drop, Temperature, Water
Journal Articles

Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems

Enes Tamdogan, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041006.
Paper No: EP-14-1089
https://doi.org/10.1115/1.4031480
Published Online: October 15, 2015
View Article titled, Natural Convection Immersion Cooling With Enhanced Optical Performance of Light-Emitting Diode Systems
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Topics: Cooling, Heat transfer, Light-emitting diodes, Natural convection, Silicones, Heat conduction, Convection, Fluids, Domes (Structural elements), Coolants
Journal Articles

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Peipei Li, Jing Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
https://doi.org/10.1115/1.4005297
Published Online: December 9, 2011
View Article titled, Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal
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Topics: Convection, Cooling, Heat, Liquid metals, Temperature, Thermal resistance, Water, Stress, Coolants, Computer cooling
Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
https://doi.org/10.1115/1.4005299
Published Online: November 17, 2011
View Article titled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
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Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)
Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
https://doi.org/10.1115/1.4002724
Published Online: November 24, 2010
View Article titled, The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives
Journal Articles

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Nihad Dukhan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
https://doi.org/10.1115/1.3143947
Published Online: June 12, 2009
View Article titled, An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction
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Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Temperature, Graphite, Metal foams, Thermal conductivity
Journal Articles

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
https://doi.org/10.1115/1.2966437
Published Online: August 12, 2008
View Article titled, A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
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Topics: Convection, Cooling, Lasers, Nozzles, Radiation (Physics), Temperature, Temperature control, Testing, Manifolds, Pressure
Journal Articles

Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader

Tong Hong Wang, Yi-Shao Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2007, 129(3): 366–370.
https://doi.org/10.1115/1.2753988
Published Online: September 12, 2006
View Article titled, Numerical Investigation of Thermal Dissipation on Quad Flat Package With Unattached Heat Spreader
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Topics: Convection, Density, Energy dissipation, Flat heat pipes, Heat transfer, Temperature
Journal Articles

Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel

Vipin Yadav, Keshav Kant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 129–143.
https://doi.org/10.1115/1.2721084
Published Online: July 23, 2006
View Article titled, Convective Cooling of a PCB Like Surface With Mixed Heating Conditions in a Vertical Channel
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Topics: Cooling, Flow (Dynamics), Heat flux, Heating, Temperature, Convection, Wall temperature, Heat
Journal Articles

Air Cooling of Variable Array of Heated Modules in a Vertical Channel

Vipin Yadav, Keshav Kant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 205–215.
https://doi.org/10.1115/1.2721594
Published Online: July 23, 2006
View Article titled, Air Cooling of Variable Array of Heated Modules in a Vertical Channel
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Topics: Computer simulation, Convection, Cooling, Flow (Dynamics), Heat transfer, Temperature, Printed circuit boards, Boundary-value problems, Turbulence, Heat flux
Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 305–310.
https://doi.org/10.1115/1.2351891
Published Online: February 10, 2006
View Article titled, A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
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Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution
Journal Articles

Modeling of Natural Convection in Electronic Enclosures

Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 157–165.
https://doi.org/10.1115/1.2188953
Published Online: September 28, 2005
View Article titled, Modeling of Natural Convection in Electronic Enclosures
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Topics: Boundary layers, Computational fluid dynamics, Convection, Engineering simulation, Heat conduction, Natural convection, Shapes, Simulation, Flow (Dynamics), Model validation
Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
https://doi.org/10.1115/1.2229225
Published Online: September 23, 2005
View Article titled, Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection
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Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials
Journal Articles

Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half

El Hassan Ridouane, Antonio Campo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 251–258.
https://doi.org/10.1115/1.2229224
Published Online: August 9, 2005
View Article titled, Heightened Thermal Convection as a Result of Splitting a Square Cavity Diagonally in Half
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Topics: Cavities, Temperature, Convection
Journal Articles

A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block

S. Kong Wang, Tzu-Chen Hung, Bau-Shi Pei, An-Fong Chen, Ja-Lin Du
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 523–529.
https://doi.org/10.1115/1.2070089
Published Online: May 3, 2005
View Article titled, A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block
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Topics: Cooling, Flow (Dynamics), Fluids, Locks (Waterways), Pressure, Temperature, Vibration, Heat, Heat transfer, Convection
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection