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Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Article titled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Open the PDF for Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
https://doi.org/10.1115/1.4051255
Published Online: September 15, 2021
View Article titled, Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure
Journal Articles

Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment

Oluwaseun Awe, Jimil M. Shah, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2020, 142(2): 024501.
Paper No: EP-19-1015
https://doi.org/10.1115/1.4046556
Published Online: April 6, 2020
View Article titled, Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment
Open the PDF for Experimental Description of Information Technology Equipment Reliability Exposed to a Data Center Using Airside Economizer Operating in Recommended and Allowable ASHRAE Envelopes in an ANSI/ISA Classified G2 Environment in another window
Topics: Corrosion, Data centers, Temperature, Contamination, Failure, Reliability
Journal Articles

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Jimil M. Shah, Abel Misrak, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
https://doi.org/10.1115/1.4043481
Published Online: May 8, 2019
View Article titled, Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
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Topics: Data centers, Fourier transform infrared spectroscopy, Particulate matter, Scanning electron microscopy, Contamination, Dust
Journal Articles

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Paul T. Vianco, Alice C. Kilgo, Bonnie M. McKenzie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
https://doi.org/10.1115/1.4039749
Published Online: May 9, 2018
View Article titled, Gold-Tin Solder Wetting Behavior for Package Lid Seals
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Topics: Solders, Tin, Ceramics, Wetting, Contamination, Solder joints
Journal Articles

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
https://doi.org/10.1115/1.4036363
Published Online: April 24, 2017
View Article titled, Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
Open the PDF for Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope in another window
Topics: Contamination, Corrosion, Data centers, Particulate matter, Temperature, Cooling, Reliability, Damage, Failure
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation

K. J. Zwick, P. S. Ayyaswamy, I. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 220–224.
https://doi.org/10.1115/1.2792095
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part II: Numerical Simulation
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Topics: Computer simulation, Hardening (Curing), Jets, Ovens, Pressure, Vapors, Design, Contamination, Flow visualization, Heat
Journal Articles

Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization

K. J. Zwick, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 215–219.
https://doi.org/10.1115/1.2792094
Published Online: September 1, 1995
View Article titled, Jet-Flow Scavenging of a Curing Oven—Part I: Flow Visualization
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Topics: Flow visualization, Hardening (Curing), Jets, Ovens, Vapors, Vortices, Condensation, Contamination, Flow (Dynamics), Bonding
Journal Articles

A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging

C. G. Woychik, A. K. Trivedi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 223–233.
https://doi.org/10.1115/1.2904371
Published Online: September 1, 1990
View Article titled, A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging
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Topics: Nickel, Packaging, Intermetallic compounds, Tin, Gold plating, Alloys, Contamination, Nickel plating, Particulate matter, Pins (Engineering)