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Journal Articles

Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

Accepted Manuscript
Pan Ren, Chulin Wang, Yaya Liang, Xuan Zhao, Xiaojie Li, DU Pingan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1071
https://doi.org/10.1115/1.4067269
Published Online: November 27, 2024
View Article titled, Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
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Topics: Ceramics, Circuits, Modeling, Signals, Three-dimensional models, Waves, Capacitance, Computational methods, Skin effect
Journal Articles

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Pradeep Lall, Hyesoo Jang, Curtis Hill
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041114.
Paper No: EP-24-1002
https://doi.org/10.1115/1.4065940
Published Online: August 17, 2024
View Article titled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition
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Topics: Capacitance, Sensors, Temperature, Water, Simulation, Reliability, Printing
Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling

Jimil M. Shah, Keerthivasan Padmanaban, Hrishabh Singh, Surya Duraisamy Asokan, Satyam Saini, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021109.
Paper No: EP-21-1016
https://doi.org/10.1115/1.4052536
Published Online: October 14, 2021
View Article titled, Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling
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Topics: Cables, Cooling, Cycles, Fluids, Mineral oil, Printed circuit boards, Reliability, Temperature, Capacitance, Optical cables
Journal Articles

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021107.
Paper No: EP-21-1056
https://doi.org/10.1115/1.4052408
Published Online: October 6, 2021
View Article titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
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Topics: Capacitance, Coolants, Gates (Closures), MOSFET transistors, Reliability, Temperature, Traction, Roads, Thermal resistance
Journal Articles

Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

Stephen H. Taylor, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
https://doi.org/10.1115/1.4028075
Published Online: September 19, 2014
View Article titled, Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
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Topics: Capacitance, Electrodes, Junctions, Network models, Sensors
Journal Articles

Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature Measurements

Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031005.
Paper No: EP-13-1107
https://doi.org/10.1115/1.4027092
Published Online: May 5, 2014
View Article titled, Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature Measurements
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Topics: Capacitance, Temperature, Transients (Dynamics), Heat transfer, Data centers, Computational fluid dynamics, Air flow
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
View Article titled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Journal Articles

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011012.
https://doi.org/10.1115/1.3078187
Published Online: February 13, 2009
View Article titled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
Open the PDF for Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading in another window
Topics: Capacitors, Ceramics, Fracture (Materials), Capacitance, Simulation
Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
https://doi.org/10.1115/1.1827264
Published Online: January 24, 2005
View Article titled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)
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Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Article titled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
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Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

Sreekant V. J. Narumanchi, Cristina H. Amon, Fellow ASME, Jayathi Y. Murthy, Mem. ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 354–361.
https://doi.org/10.1115/1.1572903
Published Online: September 17, 2003
View Article titled, Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
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Topics: Heat transfer, Jets, Temperature, Capacitance, Reynolds number
Journal Articles

Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives

Swapan K. Bhattacharya, Faculty of Research, Rao R. Tummala, Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 1–6.
https://doi.org/10.1115/1.1400751
Published Online: January 12, 2001
View Article titled, Epoxy Nanocomposite Capacitors for Application as MCM-L Compatible Integral Passives
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Topics: Capacitors, Epoxy adhesives, Epoxy resins, Manufacturing, Nanocomposites, Composite materials, Ceramics, Polymers, Fillers (Materials), Particulate matter