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Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Article titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
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Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Journal Articles

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 569–575.
https://doi.org/10.1115/1.1604803
Published Online: December 15, 2003
View Article titled, Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element
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Topics: Boundary element methods, Delamination, Fracture (Materials), Stress, Corners (Structural elements), Stress analysis (Engineering)
Journal Articles

The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber

M. Muraoka, H. Abe´, N. Aizawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 403–406.
https://doi.org/10.1115/1.2905472
Published Online: December 1, 1992
View Article titled, The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber
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Topics: Fibers, Fracture (Materials), Optical glass, Stress, Boundary element methods, Geometry, Optical fiber