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Journal Articles

Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment

Raghuram V. Pucha, Krishna Tunga, James Pyland, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 256–264.
https://doi.org/10.1115/1.1756150
Published Online: July 8, 2004
View Article titled, Accelerated Thermal Cycling Guidelines for Electronic Packages in Military Avionics Thermal Environment
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Topics: Avionics, Creep, Cycles, Military systems, Solders, Temperature, Damage
Journal Articles

Avionics Passive Cooling With Microencapsulated Phase Change Materials

A. J. Fossett, M. T. Maguire, A. A. Kudirka, F. E. Mills, D. A. Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 238–242.
https://doi.org/10.1115/1.2792628
Published Online: September 1, 1998
View Article titled, Avionics Passive Cooling With Microencapsulated Phase Change Materials
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Topics: Avionics, Cooling, Phase change materials, Aircraft, Aluminum plate, Design, Heat sinks, Missiles, Weight (Mass)
Journal Articles

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Sidharth, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 244–249.
https://doi.org/10.1115/1.2792159
Published Online: December 1, 1996
View Article titled, Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
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Topics: Corners (Structural elements), Fatigue life, Vibration, Stress, Displacement, Finite element analysis, Avionics, Boundary-value problems, Electronic packages, Electronic packaging
Journal Articles

A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics

Peter E. Jimenez, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 220–229.
https://doi.org/10.1115/1.2905689
Published Online: September 1, 1994
View Article titled, A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics
Open the PDF for A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics in another window
Topics: Aircraft, Avionics, Coolants, Flow (Dynamics), Pressure drop, Subcooling, Cooling, Heat, Military systems, Printed circuit boards