1-20 of 60
Adhesives
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041116.
Paper No: EP-24-1029
https://doi.org/10.1115/1.4066041
Published Online: August 17, 2024
View Article titled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink
Open the PDF for Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink in another window
Topics: Circuits, Design, Inks, Printing, Shear (Mechanics), Silver, Sintering, Aerosols, Stress, Water
Journal Articles

Electrically Conductive Adhesives in Microelectronics Packaging

Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041109.
Paper No: EP-23-1091
https://doi.org/10.1115/1.4065939
Published Online: August 9, 2024
View Article titled, Electrically Conductive Adhesives in Microelectronics Packaging
Open the PDF for Electrically Conductive Adhesives in Microelectronics Packaging in another window
Topics: Adhesives, Fillers (Materials), Anisotropy, Particulate matter
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Open the PDF for Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications in another window
Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature

Abderrahmane Baïri, Bruno Chanetz, J. A. Millán-García
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041009.
Paper No: EP-16-1124
https://doi.org/10.1115/1.4038113
Published Online: October 25, 2017
View Article titled, Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature
Open the PDF for Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature in another window
Topics: Adhesives, Junctions, Natural convection, Reliability, Temperature, Thermal conductivity, Packaging
Journal Articles

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Rajiv L. Iyer, Daryl L. Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
https://doi.org/10.1115/1.4037144
Published Online: July 14, 2017
View Article titled, Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
Open the PDF for Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies in another window
Topics: Adhesives, Drops, Nozzles, Pistons, Experimental design, Manufacturing, Experimental analysis, Fluids
Journal Articles

High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method

Santosh Sankarasubramanian, Jaime Cruz, Kyle Yazzie, Vaasavi Sundar, Vijay Subramanian, Tsgereda Alazar, Sivakumar Yagnamurthy, Edvin Cetegen, David McCoy, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020902.
Paper No: EP-16-1149
https://doi.org/10.1115/1.4036356
Published Online: April 24, 2017
View Article titled, High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method
Open the PDF for High-Temperature Interfacial Adhesion Strength Measurement in Electronic Packaging Using the Double Cantilever Beam Method in another window
Topics: Adhesion, Cantilever beams, Silicon, Solder masks, Temperature, Testing, High temperature, Adhesives
Journal Articles

Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate

Zhiyuan Zhu, Min Yu, Lisha Liu, Yufeng Jin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2015, 137(4): 044501.
Paper No: EP-15-1062
https://doi.org/10.1115/1.4031750
Published Online: October 20, 2015
View Article titled, Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate
Open the PDF for Temporary Bonding/Debonding of Silicon Substrates Based on Propylene Carbonate in another window
Topics: Adhesives, Bonding, Silicon, Temperature, Shear strength, Ultraviolet radiation
Journal Articles

Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect

X. C. Chen, Bo Tao, Z. P. Yin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031007.
https://doi.org/10.1115/1.4006889
Published Online: July 18, 2012
View Article titled, Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
Open the PDF for Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect in another window
Topics: Deformation, Finite element analysis, Particulate matter, Bonding, Adhesives, Anisotropy
Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
https://doi.org/10.1115/1.4001229
Published Online: March 19, 2010
View Article titled, High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer
Open the PDF for High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer in another window
Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)
Journal Articles

Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique

Chuen-Ching Wang, Yao-Ting Ye, Jing-Fung Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041009.
https://doi.org/10.1115/1.4000363
Published Online: November 12, 2009
View Article titled, Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique
Open the PDF for Fabrication of Miniature CMOS Image Sensor Using Novel Glass Cover Chip Packaging Technique in another window
Topics: Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
Open the PDF for Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging in another window
Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect

Cheng Lin, Fangang Tseng, Ching-Chang Chieng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021005.
https://doi.org/10.1115/1.2912216
Published Online: April 25, 2008
View Article titled, Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect
Open the PDF for Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect in another window
Topics: Lubricants, Self-assembly, Water, Solders, Adhesives, Manufacturing
Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
https://doi.org/10.1115/1.2753909
Published Online: October 27, 2006
View Article titled, Effect of RCC on the Reliability of Adhesive Flip Chip Joints
Open the PDF for Effect of RCC on the Reliability of Adhesive Flip Chip Joints in another window
Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination
Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
https://doi.org/10.1115/1.2721086
Published Online: August 14, 2006
View Article titled, A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging
Open the PDF for A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging in another window
Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
Open the PDF for Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems in another window
Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
https://doi.org/10.1115/1.2227057
Published Online: August 7, 2005
View Article titled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
Open the PDF for Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection in another window
Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip
Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
https://doi.org/10.1115/1.1849236
Published Online: June 3, 2005
View Article titled, Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing
Open the PDF for Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing in another window
Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
Open the PDF for Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation in another window
Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Models of Steady Heat Conduction in Multiple Cylindrical Domains

Anand Desai, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 10–17.
https://doi.org/10.1115/1.2159003
Published Online: May 18, 2005
View Article titled, Models of Steady Heat Conduction in Multiple Cylindrical Domains
Open the PDF for Models of Steady Heat Conduction in Multiple Cylindrical Domains in another window
Topics: Boundary-value problems, Geometry, Heat, Heat conduction, Heat flux, Heat sinks, Integrated circuits, Temperature, Thermal conductivity, Thermal management
Journal Articles

Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate

Liqiang Cao, Zonghe Lai, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
https://doi.org/10.1115/1.1846066
Published Online: March 21, 2005
View Article titled, Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate
Open the PDF for Interfacial Adhesion of Anisotropic Conductive Adhesives on Polyimide Substrate in another window
Topics: Adhesion, Adhesives, Anisotropy, Testing, Fracture toughness, Reliability, Pressure