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Journal Articles

Computational Framework for CFD Analysis of Loop Thermosiphon Based Embedded Cooling Systems

Accepted Manuscript
Caner Ekin Kiper, Ignacio Gallego-Marcos, Stevin Van Wyk, Yigit Akkus
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1110
https://doi.org/10.1115/1.4068209
Published Online: March 17, 2025
View Article titled, Computational Framework for CFD Analysis of Loop Thermosiphon Based Embedded Cooling Systems
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Topics: Computational fluid dynamics, Cooling systems, Simulation, Relaxation (Physics), Engineers, Modeling, Stability, Computer cooling, Density, Flat heat pipes
Journal Articles

Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN

Calvin Ling, Aizat Abas, Chew Cheng Kai, Muhammad Taufik Azahari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2025, 147(3): 031001.
Paper No: EP-24-1090
https://doi.org/10.1115/1.4067897
Published Online: March 14, 2025
View Article titled, Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
Open the PDF for Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN in another window
Topics: Convolutional neural networks, Image segmentation, Ball-Grid-Array packaging, Algorithms, Flip-chip devices, Flip-chip, Manufacturing
Image
(a) Sample TSAM polygon coordinate labeling and (b)TSAM with no void

( a ) Sample TSAM polygon coordinate labeling and ( b )TSAM with no void

in Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN > Journal of Electronic Packaging
Published Online: March 14, 2025
Fig. 1 ( a ) Sample TSAM polygon coordinate labeling and ( b )TSAM with no void More about this image found in ( a ) Sample TSAM polygon coordinate labeling and ( b )TSAM with no void
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Mask RCNN general architecture

Mask RCNN general architecture

in Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN > Journal of Electronic Packaging
Published Online: March 14, 2025
Fig. 2 Mask RCNN general architecture More about this image found in Mask RCNN general architecture
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The flowchart for the void image segmentation model buildup

The flowchart for the void image segmentation model buildup

in Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN > Journal of Electronic Packaging
Published Online: March 14, 2025
Fig. 3 The flowchart for the void image segmentation model buildup More about this image found in The flowchart for the void image segmentation model buildup
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(a)–(f) Each sample’s original image, detected output, histogram thresholding output, Otsu’s thresholding output, and actual region

( a )–( f ) Each sample’s original image, detected output, histogram thresh...

in Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN > Journal of Electronic Packaging
Published Online: March 14, 2025
Fig. 4 ( a )–( f ) Each sample’s original image, detected output, histogram thresholding output, Otsu’s thresholding output, and actual region More about this image found in ( a )–( f ) Each sample’s original image, detected output, histogram thresh...
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Boxplot for the void percentage obtained from the overall data sample

Boxplot for the void percentage obtained from the overall data sample

in Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN > Journal of Electronic Packaging
Published Online: March 14, 2025
Fig. 5 Boxplot for the void percentage obtained from the overall data sample More about this image found in Boxplot for the void percentage obtained from the overall data sample
Journal Articles

Sub-millimeter Reflector for Edge-Emitting Laser Package

Accepted Manuscript
Kuo-Tung Huang, Ying-Che Suang, Hsin-Lin Wu, Cheng-Han Wang, Qi-Hong Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag.
Paper No: EP-24-1088
https://doi.org/10.1115/1.4068142
Published Online: March 12, 2025
View Article titled, Sub-millimeter Reflector for Edge-Emitting Laser Package
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Topics: Lasers, Packaging, Glass, Semiconductors (Materials)
Journal Articles

Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics

Accepted Manuscript
Muhammad Aqil Azman, Mohd Z. Abdullah, Wei Keat Loh, Chun Keang Ooi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1099
https://doi.org/10.1115/1.4068143
Published Online: March 12, 2025
View Article titled, Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
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Topics: Computational fluid dynamics, Flow (Dynamics), Reliability, Ball-Grid-Array packaging, Electronic packages, Design, Electronic packaging, Engineering simulation, Errors, Flip-chip
Journal Articles

Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation

Aakash Mani, Jahar Sarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021010.
Paper No: EP-24-1093
https://doi.org/10.1115/1.4067775
Published Online: February 28, 2025
View Article titled, Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation
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Topics: Cooling, Heat, Temperature, Thermoelectric coolers, Thermoelectricity, Design, Simulation
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Thermoelectric coolers with considered leg geometries: (a) square leg, (b) cylindrical leg, (c) tapered cylindrical leg, and (d) inverted tapered cylindrical leg

Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( ...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 1 Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( b ) cylindrical leg, ( c ) tapered cylindrical leg, and ( d ) inverted tapered cylindrical leg More about this image found in Thermoelectric coolers with considered leg geometries: ( a ) square leg, ( ...
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Properties of considered thermoelectric materials along with temperature: (a) Seebeck coefficient, (b) electrical resistivity, and (c) thermal conductivity

Properties of considered thermoelectric materials along with temperature: (...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 2 Properties of considered thermoelectric materials along with temperature: ( a ) Seebeck coefficient, ( b ) electrical resistivity, and ( c ) thermal conductivity More about this image found in Properties of considered thermoelectric materials along with temperature: (...
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Finite element model: (a) square leg and (b) cylindrical leg

Finite element model: ( a ) square leg and ( b ) cylindrical leg

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 3 Finite element model: ( a ) square leg and ( b ) cylindrical leg More about this image found in Finite element model: ( a ) square leg and ( b ) cylindrical leg
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Grid independence test

Grid independence test

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 4 Grid independence test More about this image found in Grid independence test
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Comparison of the current model with previous results [17]: (a) temperature of p-type leg along length and (b) COP

Comparison of the current model with previous results [ 17 ]: ( a ) tempera...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 5 Comparison of the current model with previous results [ 17 ]: ( a ) temperature of p-type leg along length and ( b ) COP More about this image found in Comparison of the current model with previous results [ 17 ]: ( a ) tempera...
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Coefficient of performance and cooling effect of circular and square cross-sectional legs

Coefficient of performance and cooling effect of circular and square cross-...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 6 Coefficient of performance and cooling effect of circular and square cross-sectional legs More about this image found in Coefficient of performance and cooling effect of circular and square cross-...
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Current density distribution at 0.9 A: (a) square leg and (b) cylindrical leg

Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindric...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 7 Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindrical leg More about this image found in Current density distribution at 0.9 A: ( a ) square leg and ( b ) cylindric...
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Coefficient of performance and cooling effect of circular and square cross-sectional legs with headers

Coefficient of performance and cooling effect of circular and square cross-...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 8 Coefficient of performance and cooling effect of circular and square cross-sectional legs with headers More about this image found in Coefficient of performance and cooling effect of circular and square cross-...
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Effect of different materials for non-segmented circular leg on (a) COP and (b) cooling effect

Effect of different materials for non-segmented circular leg on ( a ) COP a...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 9 Effect of different materials for non-segmented circular leg on ( a ) COP and ( b ) cooling effect More about this image found in Effect of different materials for non-segmented circular leg on ( a ) COP a...
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(a) COP and (b) cooling effect of TEC with segmented leg of different materials

( a ) COP and ( b ) cooling effect of TEC with segmented leg of different m...

in Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation > Journal of Electronic Packaging
Published Online: February 28, 2025
Fig. 10 ( a ) COP and ( b ) cooling effect of TEC with segmented leg of different materials More about this image found in ( a ) COP and ( b ) cooling effect of TEC with segmented leg of different m...