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Volume 135, Issue 3

September 2013

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Guest Editorial
Research Papers
Technical Briefs

Guest Editorial

Introduction for Journal of Electronic Packaging Special Section on Data Centers

J. Electron. Packag. September 2013, 135(3): 030301. doi: https://doi.org/10.1115/1.4024993

Extract

View articletitled, Introduction for Journal of Electronic Packaging Special Section on Data Centers

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Topics: Data centers , Electronic packaging

Research Papers

Improved Computational Fluid Dynamics Model for Open-Aisle Air-Cooled Data Center Simulations

Waleed A. Abdelmaksoud, Thong Q. Dang, H. Ezzat Khalifa, Roger R. Schmidt

J. Electron. Packag. September 2013, 135(3): 030901. doi: https://doi.org/10.1115/1.4024766

Abstract

View articletitled, Improved Computational Fluid Dynamics Model for Open-Aisle Air-Cooled Data Center Simulations

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Topics: Computational fluid dynamics , Data centers , Flow (Dynamics) , Temperature , Tiles , Simulation

Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center

Vaibhav K. Arghode, Pramod Kumar, Yogendra Joshi, Thomas Weiss, Gary Meyer

J. Electron. Packag. September 2013, 135(3): 030902. doi: https://doi.org/10.1115/1.4024994

Abstract

View articletitled, Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center

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Topics: Air flow , Flow (Dynamics) , Tiles , Data centers

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

David J. Lettieri, Michael M. Toulouse, Cullen E. Bash, Amip J. Shah, Van P. Carey

J. Electron. Packag. September 2013, 135(3): 030903. doi: https://doi.org/10.1115/1.4024302

Abstract

View articletitled, Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

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Topics: Buoyancy , Computational fluid dynamics , Data centers , Flow (Dynamics) , Temperature , Vortices , Server racks , Approximation

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

Ethan Cruz, Yogendra Joshi

J. Electron. Packag. September 2013, 135(3): 030904. doi: https://doi.org/10.1115/1.4024944

Abstract

View articletitled, Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

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Topics: Computer simulation , Data centers , Flow (Dynamics) , Temperature , Tiles , Turbulence , Computational fluid dynamics , Uncertainty

A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center

Srinarayana Nagarathinam, Babak Fakhim, Masud Behnia, Steve Armfield

J. Electron. Packag. September 2013, 135(3): 030905. doi: https://doi.org/10.1115/1.4023214

Abstract

View articletitled, A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center

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Topics: Ceilings , Data centers , Optimization , Temperature , Tiles , Flow (Dynamics) , Turning vanes

Thermally Aware, Energy-Based Load Placement in Open-Aisle, Air-Cooled Data Centers

Dustin W. Demetriou, H. Ezzat Khalifa

J. Electron. Packag. September 2013, 135(3): 030906. doi: https://doi.org/10.1115/1.4024946

Abstract

View articletitled, Thermally Aware, Energy-Based Load Placement in Open-Aisle, Air-Cooled Data Centers

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Topics: Data centers , Stress , Temperature , Cooling , Optimization , Air flow

Expanded Assessment of a Practical Thermally Aware Energy-Optimized Load Placement Strategy for Open-Aisle, Air-Cooled Data Centers

Dustin W. Demetriou, H. Ezzat Khalifa

J. Electron. Packag. September 2013, 135(3): 030907. doi: https://doi.org/10.1115/1.4024945

Abstract

View articletitled, Expanded Assessment of a Practical Thermally Aware Energy-Optimized Load Placement Strategy for Open-Aisle, Air-Cooled Data Centers

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Topics: Data centers , Stress , Temperature , Air flow , Cooling

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome

J. Electron. Packag. September 2013, 135(3): 030908. doi: https://doi.org/10.1115/1.4024590

Abstract

View articletitled, Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

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Topics: Cooling , Flow (Dynamics) , Heat , Simulation , Transients (Dynamics) , Vapors , Two-phase flow , Temperature , Pipes , Steady state

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Maxat N. Touzelbaev, Josef Miler, Yizhang Yang, Gamal Refai-Ahmed, Kenneth E. Goodson

J. Electron. Packag. September 2013, 135(3): 031001. doi: https://doi.org/10.1115/1.4024747

Abstract

View articletitled, High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

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Topics: Filters , Modeling , Temperature , Thermal management , Transfer functions , Transients (Dynamics) , Geometry , Filtration

Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications

Nien-Hua Chao, John A. Dispenza, Mario DeAngelis

J. Electron. Packag. September 2013, 135(3): 031002. doi: https://doi.org/10.1115/1.4024301

Abstract

View articletitled, Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications

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Topics: Polymers , Density , Munitions , Temperature

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

B. Dan, B. G. Sammakia, G. Subbarayan, S. Kanuparthi

J. Electron. Packag. September 2013, 135(3): 031003. doi: https://doi.org/10.1115/1.4024392

Abstract

View articletitled, An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

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Topics: Particulate matter , Thermal conductivity , Electrical conductance , Network models , Approximation

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman

J. Electron. Packag. September 2013, 135(3): 031004. doi: https://doi.org/10.1115/1.4024112

Abstract

View articletitled, Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

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Topics: Manufacturing , Reliability , Stress , Thermomechanics , Displacement , Semiconductor wafers , Copper , Simulation , Solders

Thermal Performance of an Al₂O₃–Water Nanofluid Pulsating Heat Pipe

Hamid Reza Seyf, Sejung Kim, Yuwen Zhang

J. Electron. Packag. September 2013, 135(3): 031005. doi: https://doi.org/10.1115/1.4024145

Abstract

View articletitled, Thermal Performance of an Al<sub>2</sub>O<sub>3</sub>–Water Nanofluid Pulsating Heat Pipe

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Topics: Displacement , Fluids , Heat pipes , Heat transfer , Latent heat , Nanofluids , Nanoparticles , Particulate matter , Pressure , Slug flows

3D Compact Model of Packaged Thermoelectric Coolers

Owen Sullivan, Borislav Alexandrov, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. September 2013, 135(3): 031006. doi: https://doi.org/10.1115/1.4024653

Abstract

View articletitled, 3D Compact Model of Packaged Thermoelectric Coolers

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Topics: Thermoelectric coolers , Cooling , Electronic packages , Steady state , Flat heat pipes

Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study

G. Lorenzini, C. Biserni, L. A. O. Rocha

J. Electron. Packag. September 2013, 135(3): 031007. doi: https://doi.org/10.1115/1.4024113

Abstract

View articletitled, Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study

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Topics: Cavities , Optimization , Shapes , Thermal resistance

Technical Briefs

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

Wataru Nakayama

J. Electron. Packag. September 2013, 135(3): 034501. doi: https://doi.org/10.1115/1.4024367

Abstract

View articletitled, Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

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Topics: Heat , Heat conduction , Temperature , Thermal conductivity , Electronic equipment

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Guest Editorial

Introduction for Journal of Electronic Packaging Special Section on Data Centers

Research Papers

Improved Computational Fluid Dynamics Model for Open-Aisle Air-Cooled Data Center Simulations

Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center

Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers

Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell

A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center

Thermally Aware, Energy-Based Load Placement in Open-Aisle, Air-Cooled Data Centers

Expanded Assessment of a Practical Thermally Aware Energy-Optimized Load Placement Strategy for Open-Aisle, Air-Cooled Data Centers

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices

Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications

An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Thermal Performance of an Al₂O₃–Water Nanofluid Pulsating Heat Pipe

3D Compact Model of Packaged Thermoelectric Coolers

Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study

Technical Briefs

Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model

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