Volume 134 Issue 2 | J. Electron. Packag.

Topics: Bonding , Carbon nanotubes , Diffusion bonding (Metals) , Steady state , Test facilities , Testing , Pressure , Thermal resistance , Nanotubes , Solders

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi

J. Electron. Packag. June 2012, 134(2): 020902. doi: https://doi.org/10.1115/1.4006139

Abstract

View articletitled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Open the PDF for in another window

Topics: Bonding , Boundary element methods , Delamination , Resins , Stress , Stress singularity , Silicon , Joining , Stress concentration

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada

J. Electron. Packag. June 2012, 134(2): 020903. doi: https://doi.org/10.1115/1.4006515

Abstract

View articletitled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Open the PDF for in another window

Topics: Finite element methods , Silicon , Silicon chips , Simulation , Stress , System-in-package , Thermal stresses , Temperature , Stress concentration

Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation

Dustin W. Demetriou, H. Ezzat Khalifa

J. Electron. Packag. June 2012, 134(2): 020904. doi: https://doi.org/10.1115/1.4005907

Abstract

View articletitled, Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation

Open the PDF for in another window

Topics: Computational fluid dynamics , Cooling , Data centers , Energy consumption , Flow (Dynamics) , Optimization , Temperature , Tiles , Refrigeration , Fans

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

P. Tumne, V. Venkatadri, S. Kudtarkar, M. Delaus, D. Santos, R. Havens, K. Srihari

J. Electron. Packag. June 2012, 134(2): 020905. doi: https://doi.org/10.1115/1.4005906

Abstract

View articletitled, Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

Open the PDF for in another window

Topics: Alloys , Design , Failure , Failure mechanisms , Intermetallic compounds , Reliability , Semiconductor wafers , Solders , Separation (Technology) , Shock (Mechanics)

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl

J. Electron. Packag. June 2012, 134(2): 020906. doi: https://doi.org/10.1115/1.4006140

Abstract

View articletitled, An Overview of the IBM Power 775 Supercomputer Water Cooling System

Open the PDF for in another window

Topics: Cooling systems , Water , Heat , Cooling , Electronics , Manufacturing

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso

J. Electron. Packag. June 2012, 134(2): 020907. doi: https://doi.org/10.1115/1.4006707

Abstract

View articletitled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Open the PDF for in another window

Topics: Diffusion (Physics) , Electrodiffusion , Solder joints , Solders , Stress , Flip-chip , Finite element analysis , Grain boundary diffusion , Electric potential , Surface energy

Research Papers

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Pradeep Lall, Ryan Lowe, Kai Goebel

J. Electron. Packag. June 2012, 134(2): 021001. doi: https://doi.org/10.1115/1.4006706

Abstract

View articletitled, Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Open the PDF for in another window

Topics: Damage , Electronics , Failure , Shock (Mechanics) , Solders , Spectroscopy , Vibration , Signals , Phase shift , Stress

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

Ming Kong, Sungeun Jeon, Chiwon Hwang, Y. C. Lee

J. Electron. Packag. June 2012, 134(2): 021002. doi: https://doi.org/10.1115/1.4006513

Abstract

View articletitled, Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

Open the PDF for in another window

Topics: Manufacturing , Optoelectronic devices , Solders , Wetting , Modeling , Vehicles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman

J. Electron. Packag. June 2012, 134(2): 021003. doi: https://doi.org/10.1115/1.4006138

Abstract

View articletitled, Vacuum Packaging of MEMS by Self-Assembly

Open the PDF for in another window

Topics: Cavities , Self-assembly , Solders , Vacuum , Sealing (Process) , Manufacturing , Stability , Surface tension , Microelectromechanical systems , Shear (Mechanics)

40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Chu-Hsuan Sha, Wen P. Lin, Chin C. Lee

J. Electron. Packag. June 2012, 134(2): 021004. doi: https://doi.org/10.1115/1.4006705

Abstract

View articletitled, 40 <em>μ</em>m Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Open the PDF for in another window

Topics: Bonding , Composite materials , Copper , Flip-chip , Silicon chips , Silver

Array of Thermoelectric Coolers for On-Chip Thermal Management

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar

J. Electron. Packag. June 2012, 134(2): 021005. doi: https://doi.org/10.1115/1.4006141

Abstract

View articletitled, Array of Thermoelectric Coolers for On-Chip Thermal Management

Open the PDF for in another window

Topics: Temperature , Thermoelectric coolers , Steady state , Cooling , Transients (Dynamics) , Shapes , Temperature control

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Kota Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura

J. Electron. Packag. June 2012, 134(2): 021006. doi: https://doi.org/10.1115/1.4006142

Abstract

View articletitled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Open the PDF for in another window

Topics: Silicon chips , Stress , Mechanical properties , Flip-chip , Deformation , Copper

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno

J. Electron. Packag. June 2012, 134(2): 021007. doi: https://doi.org/10.1115/1.4005905

Abstract

View articletitled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Open the PDF for in another window

Topics: Algorithms , Circuits , Heat , Temperature , Temperature control , Thermal resistance , Thermoelectric cooling , Energy consumption , Photonics , Heat sinks

Multiobjective Optimization of a Pin-Fin Heat Sink Using Evolutionary Algorithms

Siwadol Kanyakam, Sujin Bureerat

J. Electron. Packag. June 2012, 134(2): 021008. doi: https://doi.org/10.1115/1.4006514

Abstract

View articletitled, Multiobjective Optimization of a Pin-Fin Heat Sink Using Evolutionary Algorithms

Open the PDF for in another window

Topics: Design , Evolutionary algorithms , Heat sinks , Temperature , Optimization , Pareto optimization

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO₃ Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht

J. Electron. Packag. June 2012, 134(2): 021009. doi: https://doi.org/10.1115/1.4006704

Abstract

View articletitled, Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO<sub>3</sub> Composite Dielectric

Open the PDF for in another window

Topics: Capacitance , Capacitors , Failure , Stress , Temperature , Composite materials , Epoxy resins , Failure mechanisms

Editorial

Special Issue Dedicated to Professor Avi Bar-Cohen in Celebration of His 65th Birthday

Photogallery

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation

Effect of Design Parameters on Drop Test Performance of Wafer Level Chip Scale Packages

An Overview of the IBM Power 775 Supercomputer Water Cooling System

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Research Papers

Prognostication Based on Resistance-Spectroscopy and Phase-Sensitive Detection for Electronics Subjected to Shock-Impact

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

Vacuum Packaging of MEMS by Self-Assembly

40 μm Copper–Silver Composite Flip-Chip Interconnect Technology Using Solid-State Bonding

Array of Thermoelectric Coolers for On-Chip Thermal Management

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Multiobjective Optimization of a Pin-Fin Heat Sink Using Evolutionary Algorithms

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO₃ Composite Dielectric

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Editorial

Photogallery

Research Papers

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only