Topics: Finite element model , Reliability , Silicon , Stress , Temperature , Thermomechanics , Transients (Dynamics) , Warping , Laminates , Deformation

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Lihua Liang, Yuanxiang Zhang, Yong Liu

J. Electron. Packag. September 2011, 133(3): 031002. doi: https://doi.org/10.1115/1.4004658

Abstract

View articletitled, Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

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Topics: Algorithms , Density , Electrodiffusion , Failure , Sensitivity analysis , Simulation , Solder joints , Solders , Current density , Stress

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Huy N. Phan, Dereje Agonafer

J. Electron. Packag. September 2011, 133(3): 031003. doi: https://doi.org/10.1115/1.4004847

Abstract

View articletitled, Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

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Topics: Cooling , Currents , Design , Heat , Heat sinks , Temperature , Thermoelectric coolers , Thermoelectric cooling , Cooling systems , Computer software

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Tong An, Fei Qin

J. Electron. Packag. September 2011, 133(3): 031004. doi: https://doi.org/10.1115/1.4004870

Abstract

View articletitled, Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

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Topics: Fracture (Materials) , Fracture (Process) , Solder joints , Solders , Tin , Intermetallic compounds , Failure mechanisms , Damage

Evaluating Life-Cycle Environmental Impact of Data Centers

Amip Shah, Cullen Bash, Ratnesh Sharma, Tom Christian, Brian J. Watson, Chandrakant Patel

J. Electron. Packag. September 2011, 133(3): 031005. doi: https://doi.org/10.1115/1.4004096

Abstract

View articletitled, Evaluating Life-Cycle Environmental Impact of Data Centers

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Topics: Cycles , Data centers , Modeling

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

M. O. Özdemir, H. Yüncü

J. Electron. Packag. September 2011, 133(3): 031006. doi: https://doi.org/10.1115/1.4004097

Abstract

View articletitled, Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

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Topics: Flow (Dynamics) , Forced convection , Heat , Heat transfer , Lumber , Optimization , Pressure , Pressure drop , Temperature , Laminar flow

Joint Level Test Methods for Solder Pad Cratering Investigations

Brian D. Roggeman, Venkatesh Raghavan, Peter Borgesen

J. Electron. Packag. September 2011, 133(3): 031007. doi: https://doi.org/10.1115/1.4004182

Abstract

View articletitled, Joint Level Test Methods for Solder Pad Cratering Investigations

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Topics: Laminates , Resins , Shear (Mechanics) , Solders , Testing , Stress , Failure , Temperature

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Ed J. Walsh, Thomas J. Breen, Jeff Punch, Amip J. Shah, Cullen E. Bash

J. Electron. Packag. September 2011, 133(3): 031008. doi: https://doi.org/10.1115/1.4004657

Abstract

View articletitled, From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

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Topics: Cooling , Cooling towers , Data centers , Heat sinks , Temperature , Temperature control , Modeling , Thermal resistance , Flow (Dynamics)

On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder

B. L. Boyce, L. N. Brewer, M. K. Neilsen, M. J. Perricone

J. Electron. Packag. September 2011, 133(3): 031009. doi: https://doi.org/10.1115/1.4004846

Abstract

View articletitled, On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder

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Topics: Solders , Temperature , Tin , Plasticity , Deformation , Creep

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

John H. Lau, M. S. Zhang, S. W. Ricky Lee

J. Electron. Packag. September 2011, 133(3): 031010. doi: https://doi.org/10.1115/1.4004861

Abstract

View articletitled, Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

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Topics: Design , Polymers , System-in-package , Waveguides , Simulation , Printed circuit boards , Optical interconnections , Integrated circuits , Engineering simulation , Heat

Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel

Damena D. Agonafer, J. Yeom, M. A. Shannon

J. Electron. Packag. September 2011, 133(3): 031011. doi: https://doi.org/10.1115/1.4004217

Abstract

View articletitled, Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel

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Topics: Computational fluid dynamics , Flow (Dynamics) , Microchannels , Pressure drop , Drag (Fluid dynamics) , Heat transfer , Reynolds number

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee

J. Electron. Packag. September 2011, 133(3): 031012. doi: https://doi.org/10.1115/1.4004660

Abstract

View articletitled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

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Topics: Bonding , Flip-chip , Silicon chips , Silver , Soldering , Thermal expansion , Pressure , Copper

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires

J. Electron. Packag. September 2011, 133(3): 031013. doi: https://doi.org/10.1115/1.4004830

Abstract

View articletitled, Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

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Topics: Boundary-value problems , Cooling , Density , Design , Genetic algorithms , Heat , Junctions , Modeling , Printed circuit boards , Temperature

Technical Briefs

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

Eduardo Nogueira, Manuel Vázquez, Carlos Algora

J. Electron. Packag. September 2011, 133(3): 034501. doi: https://doi.org/10.1115/1.4004659

Abstract

View articletitled, Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

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Topics: Epoxy adhesives , Epoxy resins , Failure , Light-emitting diodes , Temperature , Circuits

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Research Papers

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading

Evaluating Life-Cycle Environmental Impact of Data Centers

Optimization of Parallel, Horizontal, and Laminar Forced Air-Cooled Heat Generating Boards

Joint Level Test Methods for Solder Pad Cratering Investigations

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

On the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Technical Briefs

Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes

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