Topics: Boiling , Flow (Dynamics) , Heat transfer , Heat transfer coefficients , Microchannels , Vapors , Pressure drop , Heat flux , Heat , Flux (Metallurgy)

Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a

Eduardo Martínez-Galván, Juan Carlos Ramos, Raúl Antón, Rahmatollah Khodabandeh

J. Electron. Packag. March 2011, 133(1): 011002. doi: https://doi.org/10.1115/1.4001857

Abstract

View articletitled, Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a

Open the PDF for in another window

Topics: Cooling , Film thickness , Heat flux , Heat transfer , Sprays , Refrigerants , Critical heat flux , Temperature , Boiling

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

J. Electron. Packag. March 2011, 133(1): 011003. doi: https://doi.org/10.1115/1.4003217

Abstract

View articletitled, Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Open the PDF for in another window

Topics: Boundary-value problems , Errors , Flow (Dynamics) , Heat , Junctions , Natural convection , Temperature , Computational fluid dynamics , Optimization , Forced convection

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Thomas J. Breen, Ed J. Walsh, Jeff Punch, Amip J. Shah, Cullen E. Bash

J. Electron. Packag. March 2011, 133(1): 011004. doi: https://doi.org/10.1115/1.4003274

Abstract

View articletitled, From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

Open the PDF for in another window

Topics: Cooling , Cooling towers , Data centers , Temperature , Cooling systems , Heat , Modeling , Flow (Dynamics)

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Paolo Emilio Bagnoli, Cristina Padovani, Andrea Pagni, Giuseppe Pasquinelli

J. Electron. Packag. March 2011, 133(1): 011005. doi: https://doi.org/10.1115/1.4003516

Abstract

View articletitled, A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the <span class="small-caps">DJOSER</span> Thermal Simulator

Open the PDF for in another window

Topics: Finite element methods , Stress , Temperature , Thermomechanics , Finite element analysis , Thermal analysis

Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

K. C. Yung, H. Liem, H. S. Choy, W. K. Lun

J. Electron. Packag. March 2011, 133(1): 011006. doi: https://doi.org/10.1115/1.4003514

Abstract

View articletitled, Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

Open the PDF for in another window

Topics: Brightness (Photometry) , Heat , Light-emitting diodes , Temperature , Design , Modeling , Shapes

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Siddharth Bhopte, Bahgat Sammakia, Madhusudan Iyengar, Roger Schmidt

J. Electron. Packag. March 2011, 133(1): 011007. doi: https://doi.org/10.1115/1.4003603

Abstract

View articletitled, Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Open the PDF for in another window

Topics: Data centers , Flow (Dynamics) , Pipes , Tiles , Computer simulation , Air flow

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Xiaoling Yu, Lianghua Zhang, Enming Zhou, Quanke Feng

J. Electron. Packag. March 2011, 133(1): 011008. doi: https://doi.org/10.1115/1.4003214

Abstract

View articletitled, Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Open the PDF for in another window

Topics: Circuits , Copper , Heat , Heat transfer , Junctions , Stress , Temperature , Thermal conductivity , Thermal resistance , Transients (Dynamics)

Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration

Yuan-Chang Lin, Jiun Pyng You, Nguyen T. Tran, Yongzhi He, Frank G. Shi

J. Electron. Packag. March 2011, 133(1): 011009. doi: https://doi.org/10.1115/1.4003216

Abstract

View articletitled, Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration

Open the PDF for in another window

Topics: Light-emitting diodes , Phosphors , Packaging

An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

A. Kargar, B. Ghasemi, S. M. Aminossadati

J. Electron. Packag. March 2011, 133(1): 011010. doi: https://doi.org/10.1115/1.4003215

Abstract

View articletitled, An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

Open the PDF for in another window

Topics: Artificial neural networks , Computational fluid dynamics , Cooling , Heat , Nanofluids , Electronic components , Temperature

Technical Briefs

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Hsien-Cheng Tseng

J. Electron. Packag. March 2011, 133(1): 014501. doi: https://doi.org/10.1115/1.4003515

Abstract

View articletitled, Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Open the PDF for in another window

Topics: Design , Gallium arsenide , Genetic algorithms , Optimization , Packaging , Thermal resistance , Transistors , Thermal stability , Thermal management

All Issues

Email alerts

Accepted Manuscript Alert

New Issue Alert

RSS Feeds

Open Issues RSS Feed

Latest
Most Read
Most Cited

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

J. Electron. Packag (December 2024)

Special Issue on InterPACK2023

J. Electron. Packag

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

J. Electron. Packag (December 2024)

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

J. Electron. Packag (March 2025)

Application of the Nonlinear Fracture Mechanics Parameter

Δ

T* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

J. Electron. Packag (March 2025)

Guest Editorial

Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

Research Papers

Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding

Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration

An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids

Technical Briefs

Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Guest Editorial

Research Papers

Technical Briefs

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only