Skip Nav Destination
Issues
March 2009
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages
J. Electron. Packag. March 2009, 131(1): 011001.
doi: https://doi.org/10.1115/1.3068294
Topics:
Fatigue
,
Reliability
,
Temperature
,
Transients (Dynamics)
,
Cycles
,
Solder joints
,
Ball-Grid-Array packaging
,
Modeling
,
Steady state
Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
J. Electron. Packag. March 2009, 131(1): 011002.
doi: https://doi.org/10.1115/1.3068296
Topics:
Annealing
,
Lead-free solders
,
Mechanical properties
,
Solder joints
,
Solders
,
Temperature gradient
,
Tin
,
Testing
,
Elastic moduli
,
Nanoindentation
Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer
J. Electron. Packag. March 2009, 131(1): 011003.
doi: https://doi.org/10.1115/1.3068298
Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die
J. Electron. Packag. March 2009, 131(1): 011005.
doi: https://doi.org/10.1115/1.3068303
Topics:
Heat flux
,
Temperature
,
Temperature distribution
,
Computer simulation
,
Heat
,
Junctions
,
Heat sinks
,
Numerical analysis
,
Design
,
Optimization
Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate
J. Electron. Packag. March 2009, 131(1): 011006.
doi: https://doi.org/10.1115/1.3068305
Topics:
Resistors
,
Thin films
,
Tantalum
Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements
J. Electron. Packag. March 2009, 131(1): 011007.
doi: https://doi.org/10.1115/1.3068311
Topics:
Impact testing
,
Reliability
,
Simulation
,
Solders
,
Testing
,
Deflection
,
Damping
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
J. Electron. Packag. March 2009, 131(1): 011008.
doi: https://doi.org/10.1115/1.3068313
Topics:
Alloys
,
Cycles
,
Dynamic light scattering
,
Fatigue
,
Fatigue life
,
Finite element analysis
,
Fracture (Materials)
,
Lead-free solders
,
Simulation
,
Solders
Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators
J. Electron. Packag. March 2009, 131(1): 011009.
doi: https://doi.org/10.1115/1.3068318
Topics:
Finite element analysis
,
Glass
,
Press fits
,
Shear stress
,
Stress
,
Thermal stresses
,
Welding
,
Wire
,
Bridges (Structures)
,
Laser welding
Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis
J. Electron. Packag. March 2009, 131(1): 011010.
doi: https://doi.org/10.1115/1.3068321
Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity
J. Electron. Packag. March 2009, 131(1): 011011.
doi: https://doi.org/10.1115/1.3068322
Topics:
Flow (Dynamics)
,
Heat
,
Pressure drop
,
Reynolds number
,
Temperature
,
Thermal management
,
Transients (Dynamics)
,
Steady state
,
Cycles
,
Finite element methods
Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
J. Electron. Packag. March 2009, 131(1): 011012.
doi: https://doi.org/10.1115/1.3078187
Topics:
Capacitors
,
Ceramics
,
Fracture (Materials)
,
Capacitance
,
Simulation
Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals
J. Electron. Packag. March 2009, 131(1): 011013.
doi: https://doi.org/10.1115/1.3068301
Topics:
Electronic packages
,
Flip-chip devices
,
Lasers
,
Signals
,
Solders
,
Tin
,
Ultrasound
,
Vehicles
,
X-rays
,
Inspection
Sub- SnAg Solder Bumping Technology and the Bump Reliability
J. Electron. Packag. March 2009, 131(1): 011014.
doi: https://doi.org/10.1115/1.2957333
Topics:
Solders
,
Shear strength
,
Reliability
,
Tin
Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages
J. Electron. Packag. March 2009, 131(1): 011015.
doi: https://doi.org/10.1115/1.3077131
Topics:
Design
,
Microchannels
,
Optimization
,
Heat
Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation
J. Electron. Packag. March 2009, 131(1): 011016.
doi: https://doi.org/10.1115/1.3078195
Topics:
Durability
,
Excitation
,
Fatigue
,
Printed circuit boards
,
Solders
,
Vibration
,
Finite element analysis
,
Failure
Research Papers
Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance
J. Electron. Packag. March 2009, 131(1): 011004.
doi: https://doi.org/10.1115/1.3068299
Technical Briefs
Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin
G. De Mey, M. Wójcik, J. Pilarski, M. Lasota, J. Banaszczyk, B. Vermeersch, A. Napieralski, M. De Paepe
J. Electron. Packag. March 2009, 131(1): 014501.
doi: https://doi.org/10.1115/1.3068307
Topics:
Cooling
,
Natural convection
,
Thermal resistance
,
Transistors
,
Junctions
Email alerts
RSS Feeds
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)