Volume 129 Issue 4 | J. Electron. Packag.

Research Papers

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Pradeep Lall, Dhananjay Panchagade, Yueli Liu, Wayne Johnson, Jeff Suhling

J. Electron. Packag. December 2007, 129(4): 373–381. doi: https://doi.org/10.1115/1.2804085

View articletitled, Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Topics: Ball-Grid-Array packaging , Displacement , Errors , Finite element model , Reliability , Shells , Shock (Mechanics) , Transients (Dynamics) , Dynamics (Mechanics) , Modeling

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Pradeep Lall, Nokibul Islam, John Evans, Jeff Suhling

J. Electron. Packag. December 2007, 129(4): 382–390. doi: https://doi.org/10.1115/1.2804086

Abstract

View articletitled, Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Open the PDF for in another window

Topics: Ball-Grid-Array packaging , Crack propagation , Cycles , Fracture (Materials) , Lumber , Metals , Reliability , Resistors , Solder joints , Printed circuit boards

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Li Zhang, Vijaylaxmi Gumaste, Anindya Poddar, Luu Nguyen, Gary Schulze

J. Electron. Packag. December 2007, 129(4): 391–399. doi: https://doi.org/10.1115/1.2753886

Abstract

View articletitled, Analytical and Experimental Characterization of Bonding Over Active Circuitry

Open the PDF for in another window

Topics: Bonding , Fracture (Materials) , Friction , Stress , Ultrasound , Wire , Finite element analysis , Finite element model

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung

J. Electron. Packag. December 2007, 129(4): 400–410. doi: https://doi.org/10.1115/1.2804087

Abstract

View articletitled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

Open the PDF for in another window

Topics: Disks , Heat transfer , Nozzles , Reynolds number , Transients (Dynamics) , Turbulence , Heat flux , Steady state , Jets , Rotation

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung

J. Electron. Packag. December 2007, 129(4): 411–420. doi: https://doi.org/10.1115/1.2804089

Abstract

View articletitled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Open the PDF for in another window

Topics: Design , Disks , Heat transfer , Multi-chip modules , Nozzles , Optimization , Reynolds number , Sensitivity analysis

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Samson Yoon, Bongtae Han, Zhaoyang Wang

J. Electron. Packag. December 2007, 129(4): 421–426. doi: https://doi.org/10.1115/1.2804090

Abstract

View articletitled, On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

Open the PDF for in another window

Topics: Diffusion (Physics)

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Krishna Tunga, Suresh K. Sitaraman

J. Electron. Packag. December 2007, 129(4): 427–433. doi: https://doi.org/10.1115/1.2804091

Abstract

View articletitled, An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Open the PDF for in another window

Topics: Ball-Grid-Array packaging , Ceramics , Fatigue life , Solders , Ball-Grid-Array packages , Interferometry , Lasers

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography

Hiroyuki Tsuritani, Toshihiko Sayama, Kentaro Uesugi, Takeshi Takayanagi, Takao Mori

J. Electron. Packag. December 2007, 129(4): 434–439. doi: https://doi.org/10.1115/1.2804093

Abstract

View articletitled, Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography

Open the PDF for in another window

Topics: Cycles , Nondestructive evaluation , Solders , X-rays , Synchrotron radiation , Flip-chip devices , Tin , Reliability , Computerized tomography

A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance

Karan Kacker, Thomas Sokol, Wansuk Yun, Madhavan Swaminathan, Suresh K. Sitaraman

J. Electron. Packag. December 2007, 129(4): 460–468. doi: https://doi.org/10.1115/1.2804096

Abstract

View articletitled, A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance

Open the PDF for in another window

Topics: Automotive design , Manufacturing , Reliability , Dielectric materials , Stress , Thermomechanics , Semiconductor wafers , Finite element analysis , Fracture (Materials)

High Thermal Conductive ${Si}_{3} N_{4}$ Particle Filled Epoxy Composites With a Novel Structure

Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang

J. Electron. Packag. December 2007, 129(4): 469–472. doi: https://doi.org/10.1115/1.2804097

Abstract

View articletitled, High Thermal Conductive <span class="inline-formula no-formula-id"><span class="mathFormula"></span><math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><msub><mi mathvariant="normal">Si</mi><mn>3</mn></msub><msub><mi mathvariant="normal">N</mi><mn>4</mn></msub></mrow></math></span> Particle Filled Epoxy Composites With a Novel Structure

Open the PDF for in another window

Topics: Ceramics , Composite materials , Epoxy resins , Fillers (Materials) , Particulate matter , Polymers , Thermal conductivity , Dielectric losses , Polymer composites

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

J. W. Wan, W. J. Zhang, D. J. Bergstrom

J. Electron. Packag. December 2007, 129(4): 473–478. doi: https://doi.org/10.1115/1.2804098

Abstract

View articletitled, A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

Open the PDF for in another window

Topics: Clearances (Engineering) , Flip-chip packages , Solders , Design

Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling

Z. A. Williams, J. A. Roux

J. Electron. Packag. December 2007, 129(4): 488–495. doi: https://doi.org/10.1115/1.2804100

Abstract

View articletitled, Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling

Open the PDF for in another window

Topics: Computational fluid dynamics , Cooling , Copper , Fins , Temperature , Thermal management , Water , Graphite , Flow (Dynamics) , Density

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

John H. L. Pang, F. X. Che

J. Electron. Packag. December 2007, 129(4): 496–503. doi: https://doi.org/10.1115/1.2809442

Abstract

View articletitled, Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

Open the PDF for in another window

Topics: Cycles , Density , Displacement , Fatigue , Fatigue testing , Finishes , Finite element analysis , High temperature , Lead-free solders , Manufacturing

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Brian Smith, Cristina Amon

J. Electron. Packag. December 2007, 129(4): 504–511. doi: https://doi.org/10.1115/1.2804101

Abstract

View articletitled, Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Open the PDF for in another window

Topics: Heat , Manufacturing , Sensors , Temperature , Thermal conductivity , Thermal diffusion , Thermal properties , Boundary-value problems , Microsensors , Strips

Research Papers

Heat Conduction in Multilayered Rectangular Domains

James Geer, Anand Desai, Bahgat Sammakia

J. Electron. Packag. December 2007, 129(4): 440–451. doi: https://doi.org/10.1115/1.2804094

Abstract

View articletitled, Heat Conduction in Multilayered Rectangular Domains

Open the PDF for in another window

Topics: Boundary-value problems , Heat , Heat conduction , Temperature , Thermal management

A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays

Milan Visaria, Issam Mudawar

J. Electron. Packag. December 2007, 129(4): 452–459. doi: https://doi.org/10.1115/1.2804095

Abstract

View articletitled, A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays

Open the PDF for in another window

Topics: Critical heat flux , Nozzles , Sprays , Flow (Dynamics)

Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink

Abel Siu-Ho, Weilin Qu, Frank Pfefferkorn

J. Electron. Packag. December 2007, 129(4): 479–487. doi: https://doi.org/10.1115/1.2804099

Abstract

View articletitled, Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink

Open the PDF for in another window

Topics: Flow (Dynamics) , Friction , Heat sinks , Heat transfer , Pressure drop , Reynolds number , Water , Fins , Temperature , Heat flux

Technical Briefs

An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques

Thomas E. Salem, Stephen B. Bayne, Don Porschet

J. Electron. Packag. December 2007, 129(4): 512–517. doi: https://doi.org/10.1115/1.2814056

Abstract

View articletitled, An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques

Open the PDF for in another window

Topics: Heat sinks , Water , Poles (Building) , Microchannels

Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array

Gaowei Xu, Yingjun Cheng, Le Luo

J. Electron. Packag. December 2007, 129(4): 518–521. doi: https://doi.org/10.1115/1.2804102

Abstract

View articletitled, Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array

Open the PDF for in another window

Topics: Design , Heat sinks , Heat transfer , Thermal resistance , Computational fluid dynamics , Simulation

Research Papers

Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

On Moisture Diffusion Modeling Using Thermal-Moisture Analogy

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography

A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance

High Thermal Conductive ${Si}_{3} N_{4}$ Particle Filled Epoxy Composites With a Novel Structure

A Theoretical Analysis of the Concept of Critical Clearance Toward a Design Methodology for the Flip-Chip Package

Thermal Management of a High Packing Density Array of Power Amplifiers Using Liquid Cooling

Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints

Simultaneous Electrothermal Test Method for Pyroelectric Microsensors

Research Papers

Heat Conduction in Multilayered Rectangular Domains

A Systematic Approach to Predicting Critical Heat Flux for Inclined Sprays

Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink

Technical Briefs

An Experimental Approach for Thermal Characterization of Water-Cooled Heat Sinks Using Fourier Analysis Techniques

Heat-Transfer Characteristics and Design Optimization for a Small-Sized Plate-Fin Heat Sink Array

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Research Papers

Research Papers

Technical Briefs

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only