Volume 125 Issue 4 | J. Electron. Packag.

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Volume 125, Issue 4

December 2003

ISSN 1043-7398

EISSN 1528-9044

Foreword

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

L. J. Ernst, Guest Editor, G. Q. Zhang, Guest Editor

J. Electron. Packag. December 2003, 125(4): 465. doi: https://doi.org/10.1115/1.1634590

Abstract

View articletitled, Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

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Topics: Engineering simulation , Microelectromechanical systems , Microelectronic devices , Optimization , Thermal management , Computer simulation , Failure analysis , Micromechanical devices , Packaging

Technical Papers

Four-Terminal Measurement and Simulations for Sheet Resistance in Piezoresistive Sensing Elements

Steven Chen, J. Albert Chiou, Mem. ASME

J. Electron. Packag. December 2003, 125(4): 466–469. doi: https://doi.org/10.1115/1.1615250

Abstract

View articletitled, Four-Terminal Measurement and Simulations for Sheet Resistance in Piezoresistive Sensing Elements

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Topics: Diffusion (Physics) , Finite element analysis , Simulation , Semiconductor wafers , Pressure

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

J. Albert Chiou, Mem. ASME, Steven Chen, Jinbao Jiao

J. Electron. Packag. December 2003, 125(4): 470–474. doi: https://doi.org/10.1115/1.1615249

Abstract

View articletitled, Humidity-Induced Voltage Shift on MEMS Pressure Sensors

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Topics: Bonding , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Finite element analysis , Microelectromechanical systems , Pressure , Pressure sensors , Silicon , Stress , Surface tension

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni

J. Electron. Packag. December 2003, 125(4): 475–479. doi: https://doi.org/10.1115/1.1615796

Abstract

View articletitled, A Vapotron Effect Application for Electronic Equipment Cooling

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Topics: Boiling , Cavities , Cooling , Electronic equipment , Fluids , Forced convection , Heat transfer coefficients , Heating , Refrigerants , Temperature

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

Reena Cole, Mark Davies, Jeff Punch

J. Electron. Packag. December 2003, 125(4): 480–489. doi: https://doi.org/10.1115/1.1604811

Abstract

View articletitled, A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

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Topics: Flat plates , Flow (Dynamics) , Temperature , Thermal conductivity , Thermal resistance , Vehicles , Reynolds number , Boundary layers , Junctions , Measurement systems

Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst

J. Electron. Packag. December 2003, 125(4): 490–497. doi: https://doi.org/10.1115/1.1604149

Abstract

View articletitled, Response Surface Modeling for Nonlinear Packaging Stresses

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Topics: Design , Finite element model , Packaging , Response surface methodology , Stress , Temperature , Optimization , Modeling , Solders , Testing

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Bart Vandevelde, Eric Beyne, Kouchi (G.Q.) Zhang, Jo Caers, Dirk Vandepitte, Martine Baelmans

J. Electron. Packag. December 2003, 125(4): 498–505. doi: https://doi.org/10.1115/1.1604150

Abstract

View articletitled, Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

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Topics: Finite element analysis , Reliability , Simulation , Solder joints , Solders , Modeling , Thermomechanics , Sensitivity analysis , Design , Dimensions

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Jaap M. J. den Toonder, Mem. ASME, Christian W. Rademaker, Ching-Li Hu

J. Electron. Packag. December 2003, 125(4): 506–511. doi: https://doi.org/10.1115/1.1604151

Abstract

View articletitled, Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

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Topics: Capacitors , Ceramics , Computation , Computer simulation , Cooling , Finite element analysis , Residual stresses , Simulation , Sintering , Stress

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

C. J. Liu, L. J. Ernst, G. Wisse, G. Q. Zhang, M. Vervoort

J. Electron. Packag. December 2003, 125(4): 512–519. doi: https://doi.org/10.1115/1.1604152

Abstract

View articletitled, Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

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Topics: Buckling , Ceramics , Copper , Delamination , Finite element methods , Finite element model , Simulation , Stress , Temperature , Deformation

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

W. D. van Driel, J. H. J. Janssen, G. Q. Zhang, D. G. Yang, L. J. Ernst

J. Electron. Packag. December 2003, 125(4): 520–526. doi: https://doi.org/10.1115/1.1604153

Abstract

View articletitled, Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

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Topics: Anisotropy , Molding , Packaging , Stress , Temperature , Viscoelasticity , Finite element analysis

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

M. Carmona, S. Marco, J. Samitier, M. C. Acero, J. A. Plaza, J. Esteve

J. Electron. Packag. December 2003, 125(4): 527–530. doi: https://doi.org/10.1115/1.1604154

Abstract

View articletitled, Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

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Topics: Micropumps , Simulation , Finite element methods , Engineering simulation , Modeling , Membranes , Thermomechanics

Characterization of Lead-Free Solders in Flip Chip Joints

S. Wiese, E. Meusel

J. Electron. Packag. December 2003, 125(4): 531–538. doi: https://doi.org/10.1115/1.1604155

Abstract

View articletitled, Characterization of Lead-Free Solders in Flip Chip Joints

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Topics: Crack propagation , Creep , Flip-chip , Flip-chip devices , Solders , Stress , Fatigue , Temperature

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

L. J. Ernst, G. Q. Zhang, K. M. B. Jansen, H. J. L. Bressers

J. Electron. Packag. December 2003, 125(4): 539–548. doi: https://doi.org/10.1115/1.1604156

Abstract

View articletitled, Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

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Topics: Creep , Molding , Poisson ratio , Stress , Temperature , Relaxation (Physics) , Packaging

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

J. Puigcorbe´, S. Marco, S. Leseduarte, M. Carmona, O. Vendier, C. Devron, S. L. Delage, D. Floriot, H. Blanck

J. Electron. Packag. December 2003, 125(4): 549–555. doi: https://doi.org/10.1115/1.1604157

Abstract

View articletitled, Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

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Topics: Bonding , Creep , Finite element analysis , Flip-chip devices , Modeling , Optimization , Stress , Temperature , Transistors , Gallium arsenide

Three- and Four-Point Bend Testing for Electronic Packages

Santosh Shetty, Tommi Reinikainen

J. Electron. Packag. December 2003, 125(4): 556–561. doi: https://doi.org/10.1115/1.1604158

Abstract

View articletitled, Three- and Four-Point Bend Testing for Electronic Packages

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Topics: Printed circuit boards , Reliability , Simulation , Solder joints , Stress , Testing , Electronic packages , Failure

Reliability Prediction of Area Array Solder Joints

Rainer Dudek, Ralf Do¨ring, Bernd Michel

J. Electron. Packag. December 2003, 125(4): 562–568. doi: https://doi.org/10.1115/1.1604802

Abstract

View articletitled, Reliability Prediction of Area Array Solder Joints

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Topics: Ball-Grid-Array packaging , Creep , Fatigue , Modeling , Reliability , Solder joints , Solders , Temperature , Cycles , Geometric modeling

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

A. A. O. Tay, K. H. Lee, K. M. Lim

J. Electron. Packag. December 2003, 125(4): 569–575. doi: https://doi.org/10.1115/1.1604803

Abstract

View articletitled, Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

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Topics: Boundary element methods , Delamination , Fracture (Materials) , Stress , Corners (Structural elements) , Stress analysis (Engineering)

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

Chang-An Yuan, Research Assistant, Kou-Ning Chiang, Professor

J. Electron. Packag. December 2003, 125(4): 576–581. doi: https://doi.org/10.1115/1.1604159

Abstract

View articletitled, Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

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Topics: Packaging , Semiconductor wafers , Simulation , Solder joints , Shear (Mechanics) , Finite element analysis , Thermomechanics , Materials properties , Fatigue life , Finite element model

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

X. J. Zhao, G. Q. Zhang, J. F. J. M. Caers, L. J. Ernst

J. Electron. Packag. December 2003, 125(4): 582–588. doi: https://doi.org/10.1115/1.1604160

Abstract

View articletitled, Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

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Topics: Deformation , Fatigue , Fatigue life , Solder joints , Solders , Modeling , Damage , Cycles , Packaging

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Victor Adrian Chiriac, Tien-Yu Tom Lee

J. Electron. Packag. December 2003, 125(4): 589–596. doi: https://doi.org/10.1115/1.1604804

Abstract

View articletitled, Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

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Topics: Gallium arsenide , Metals , Temperature , Thermal conductivity , Wall thickness , Thermal resistance

Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects

R. T. P. Lee, A. S. Zuruzi, S. K. Lahiri

J. Electron. Packag. December 2003, 125(4): 597–601. doi: https://doi.org/10.1115/1.1604806

Abstract

View articletitled, Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects

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Topics: Flip-chip devices , Manufacturing , Solders , Flip-chip

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

John H. Lau, Fellow ASME, Steve Erasmus, Yida Zou

J. Electron. Packag. December 2003, 125(4): 602–608. doi: https://doi.org/10.1115/1.1604807

Abstract

View articletitled, Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

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Topics: Deflection , Glass , Stress , Boundary-value problems , Pressure , Temperature , Double refraction , Thermal stresses

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

G. B. Dou, Y. C. Chan, Johan Liu

J. Electron. Packag. December 2003, 125(4): 609–616. doi: https://doi.org/10.1115/1.1604808

Abstract

View articletitled, Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

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Topics: Particulate matter , Nickel

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

Tan Chee Wei, Abdul Razak Daud

J. Electron. Packag. December 2003, 125(4): 617–620. doi: https://doi.org/10.1115/1.1604809

Abstract

View articletitled, Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

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Topics: Intermetallic compounds , Bonding , Copper , Shear (Mechanics) , Electrical properties , Electrical resistance , Wire bonding , Wire

Technical Briefs

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

John H. Lau, Stephen H. Pan

J. Electron. Packag. December 2003, 125(4): 621–624. doi: https://doi.org/10.1115/1.1604805

Abstract

View articletitled, 3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

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Topics: Boundary-value problems , Compressive stress , Copper , Finite element analysis , Stress , Stress analysis (Engineering) , Tin , Chemical reactions , Displacement , Materials properties

Effect of Bonding Force on the Conducting Particle With Different Sizes

N. H. Yeung, Y. C. Chan, C. W. Tan

J. Electron. Packag. December 2003, 125(4): 624–629. doi: https://doi.org/10.1115/1.1604810

Abstract

View articletitled, Effect of Bonding Force on the Conducting Particle With Different Sizes

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Topics: Bonding , Particulate matter , Deformation , Finite element analysis , Stress , Particle size

Foreword

Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems

Technical Papers

Four-Terminal Measurement and Simulations for Sheet Resistance in Piezoresistive Sensing Elements

Humidity-Induced Voltage Shift on MEMS Pressure Sensors

A Vapotron Effect Application for Electronic Equipment Cooling

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

Response Surface Modeling for Nonlinear Packaging Stresses

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Residual Stresses in Multilayer Ceramic Capacitors: Measurement and Computation

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

Characterization of Lead-Free Solders in Flip Chip Joints

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

Finite Element Modelling of Flip Chip Gold-Gold Thermocompression Bonding

Three- and Four-Point Bend Testing for Electronic Packages

Reliability Prediction of Area Array Solder Joints

Numerical Simulation of Delamination in IC Packages Using a New Variable-Order Singular Boundary Element

Micro to Macro Thermo-Mechanical Simulation of Wafer Level Packaging

Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion

Impact of Die Attach Material and Substrate Design on RF GaAs Power Amplifier Devices Thermal Performance

Maskless Process for Fabrication of Ultra-Fine Pitch Solder Bumps for Flip Chip Interconnects

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

Mechanical and Electrical Properties of Au-Al and Cu-Al Intermetallics Layer at Wire Bonding Interface

Technical Briefs

3D Nonlinear Stress Analysis of Tin Whisker Initiation on Lead-Free Components

Effect of Bonding Force on the Conducting Particle With Different Sizes

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Foreword

Technical Papers

Technical Briefs

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