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Issues
September 2001
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Local Heat Transfer Distributions in Confined Multiple Air Jet Impingement
J. Electron. Packag. September 2001, 123(3): 165–172.
doi: https://doi.org/10.1115/1.1371923
Topics:
Air jets
,
Flow (Dynamics)
,
Heat
,
Heat transfer
,
Heat transfer coefficients
,
Jets
,
Reynolds number
Sizing of Heat Spreaders Above Dielectric Layers
J. Electron. Packag. September 2001, 123(3): 173–181.
doi: https://doi.org/10.1115/1.1377271
Topics:
Flat heat pipes
,
Thermal resistance
,
Finite element analysis
,
Heat
Simplified Analytical Models for Forced Convection Heat Transfer From Cuboids of Arbitrary Shape
J. R. Culham, Associate Professor and Director, Mem. ASME, M. M. Yovanovich, Distinguished Professor Emeritus, Fellow ASME, P. Teertstra, Research Associate, C.-S. Wang, G. Refai-Ahmed, Mem. ASME, Ra-Min Tain
J. Electron. Packag. September 2001, 123(3): 182–188.
doi: https://doi.org/10.1115/1.1347993
Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader
J. Electron. Packag. September 2001, 123(3): 189–195.
doi: https://doi.org/10.1115/1.1348010
Topics:
Flat heat pipes
,
Heat
,
Heat pipes
,
Thermal resistance
,
Temperature
,
Laptop computers
An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling
J. Electron. Packag. September 2001, 123(3): 196–199.
doi: https://doi.org/10.1115/1.1347987
Topics:
Electronic packages
,
Finite element analysis
,
Laser beams
,
Temperature
,
Flip-chip packages
,
Warping
,
Thermal expansion
,
Deformation
,
Lasers
,
Packaging
A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages
J. Electron. Packag. September 2001, 123(3): 200–210.
doi: https://doi.org/10.1115/1.1348337
Topics:
Electronic packages
,
Heat transfer
,
Temperature
,
Computer simulation
,
Heat
,
Heat flux
,
Optimization
Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses
J. Electron. Packag. September 2001, 123(3): 211–217.
doi: https://doi.org/10.1115/1.1370376
Topics:
Electronics
,
Melting
,
Steady state
,
Temperature
,
Transients (Dynamics)
,
Junctions
,
Design
,
Temperature distribution
,
Phase change materials
Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging
J. Electron. Packag. September 2001, 123(3): 218–224.
doi: https://doi.org/10.1115/1.1362674
Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
J. Electron. Packag. September 2001, 123(3): 225–231.
doi: https://doi.org/10.1115/1.1348012
Topics:
Air flow
,
Computational fluid dynamics
,
Computers
,
Design
,
Heat sinks
,
Temperature
,
Ducts
,
Vents
,
Modeling
,
Computer simulation
A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
J. Electron. Packag. September 2001, 123(3): 232–237.
doi: https://doi.org/10.1115/1.1349423
Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy
J. Electron. Packag. September 2001, 123(3): 238–246.
doi: https://doi.org/10.1115/1.1371232
Topics:
Alloys
,
Creep
,
Deformation
,
Solders
,
Temperature
,
Thermomechanics
,
Tin
,
Stress
,
Plasticity
Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
J. Electron. Packag. September 2001, 123(3): 247–253.
doi: https://doi.org/10.1115/1.1371781
Topics:
Creep
,
Deformation
,
Solders
,
Steady state
,
Stress
,
Temperature
,
Constitutive equations
,
Finite element analysis
,
Alloys
,
Solder joints
Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
J. Electron. Packag. September 2001, 123(3): 254–259.
doi: https://doi.org/10.1115/1.1348019
Topics:
Abrasive machining
,
Abrasives
,
Brittleness
,
Cutting
,
Deformation
,
Fracture (Materials)
,
Particulate matter
,
Stress
,
Wire
,
Modeling
Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach
J. Electron. Packag. September 2001, 123(3): 260–267.
doi: https://doi.org/10.1115/1.1349422
Warpage of Plastic IC Packages as a Function of Processing Conditions
J. Electron. Packag. September 2001, 123(3): 268–272.
doi: https://doi.org/10.1115/1.1349421
Orientation Specific Thermal Properties of Polyimide Film
J. Electron. Packag. September 2001, 123(3): 273–277.
doi: https://doi.org/10.1115/1.1347986
Topics:
Heat
,
Thermal conductivity
,
Wire
,
Polymers
,
Optical microscopy
,
Thermal properties
Characteristics of Creep Damage for 60 Sn-40 Pb Solder Material
J. Electron. Packag. September 2001, 123(3): 278–283.
doi: https://doi.org/10.1115/1.1372319
Papers on Reliability
The Effect of Solder Paste Volume and Reflow Ambient Atmosphere on Reliability of CBGA Assemblies
J. Electron. Packag. September 2001, 123(3): 284–289.
doi: https://doi.org/10.1115/1.1371782
Topics:
Fatigue life
,
Reliability
,
Solder joints
,
Solders
,
Thermal shock
,
Ball-Grid-Array packaging
,
Vibration
,
Ceramics
,
Nitrogen
,
Cycles
Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds
J. Electron. Packag. September 2001, 123(3): 290–294.
doi: https://doi.org/10.1115/1.1347997
Topics:
Conveyor systems
,
Cooling
,
Cycles
,
Fatigue
,
Shear (Mechanics)
,
Solder joints
,
Solders
,
Ball-Grid-Array packaging
,
Heat transfer
,
Solidification
Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages
J. Electron. Packag. September 2001, 123(3): 295–301.
doi: https://doi.org/10.1115/1.1348338
Topics:
Delamination
,
Fracture (Materials)
,
Solders
,
Stress
,
Fracture (Process)
,
Flip-chip packages
,
Finite element analysis
Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending
J. Electron. Packag. September 2001, 123(3): 302–308.
doi: https://doi.org/10.1115/1.1362673
Topics:
Cycles
,
Failure
,
Fatigue
,
Fatigue testing
,
Finite element analysis
,
Solder joints
,
Stress
,
Durability
,
Fatigue life
Technical Briefs
Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement
J. Electron. Packag. September 2001, 123(3): 309–311.
doi: https://doi.org/10.1115/1.1371925
Topics:
Contact resistance
,
Copper
,
Cycles
,
Disks
,
Electrical conductance
,
Heating
,
Silicones
,
Sodium
,
Thermal conductivity
,
Thermal stability
Effect of Stress Ratio on Fatigue Crack Growth in 95Pb-5Sn Solder
J. Electron. Packag. September 2001, 123(3): 311–315.
doi: https://doi.org/10.1115/1.1371780
Topics:
Fatigue cracks
,
Fracture (Materials)
,
Solders
,
Stress
,
Fracture (Process)
Numerical Analysis of Impinging Air Flow and Heat Transfer in Plate-Fin Type Heat Sinks
J. Electron. Packag. September 2001, 123(3): 315–318.
doi: https://doi.org/10.1115/1.1371924
Topics:
Air flow
,
Flow (Dynamics)
,
Heat sinks
,
Heat transfer
,
Numerical analysis
,
Fins
,
Pressure drop
Book Review
Industrial Electonics: Devices and Systems, Second Edition
J. Electron. Packag. September 2001, 123(3): 319.
doi: https://doi.org/10.1115/1.1387243
Topics:
Engineers
,
Transistors
,
Computers
,
Junctions
,
Electronics
,
Electronics engineers
,
Energy resources
,
Gates (Closures)
,
Generators
,
Mechanical engineering
Email alerts
RSS Feeds
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag