In this work, a sinusoidal vibration test method with resonance tracking is employed for reliability testing of circuit assemblies. The system continuously monitors for changes in the resonant frequency of the circuit board and adjusts the excitation frequency to match the resonant frequency. The test setup includes an electrodynamic shaker with a real-time vibration control, resistance monitoring for identifying electrical failures of interconnects, and vibration logging for monitoring changes in the dynamic response of the assembly over time. Reliability tests were performed using the resonance tracking sinusoidal test method for assemblies, each consisting of a centrally mounted ball grid array (BGA) device assembled with 63Sn37Pb and SAC105 solder alloys. These tests show that the resonance tracking method gives more consistent failure times. Failure analysis for the tested devices shows the primary failure mode is “input” trace crack first, followed by fatigue through the solder for complete failure. A finite element (FE) model, correlated with experimental modal analysis, is shown to accurately estimate the circuit board deflection estimated from the harmonic vibration data. This provides a means of estimating the stresses in the electronic interconnections while accounting for the variability between test parts. These fine-tuned vibration measurement techniques and related FE models provide the building blocks for high cycle solder fatigue plots (i.e., S–N curves).
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December 2018
Research-Article
Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
Quang T. Su,
Quang T. Su
Mechanical Engineering Department,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Search for other works by this author on:
Mohammad A. Gharaibeh,
Mohammad A. Gharaibeh
Mechanical Engineering Department,
The Hashemite University,
Zarqa 13115, Jordan
e-mail: mohammada_fa@hu.edu.jo
The Hashemite University,
Zarqa 13115, Jordan
e-mail: mohammada_fa@hu.edu.jo
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Aaron J. Stewart,
Aaron J. Stewart
Mechanical Engineering Department,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: astewar5@binghamton.edu
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: astewar5@binghamton.edu
Search for other works by this author on:
James M. Pitarresi,
James M. Pitarresi
Mechanical Engineering Department,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Search for other works by this author on:
Martin K. Anselm
Martin K. Anselm
Manufacturing and Mechanical Engineering
Technology (MMET),
Center for Electronic Manufacturing and
Assembly (CEMA),
Rochester Institute of Technology (RIT),
One Lomb Memorial Drive,
Rochester, NY 14623-5603
e-mail: mkamet@rit.edu
Technology (MMET),
Center for Electronic Manufacturing and
Assembly (CEMA),
Rochester Institute of Technology (RIT),
One Lomb Memorial Drive,
Rochester, NY 14623-5603
e-mail: mkamet@rit.edu
Search for other works by this author on:
Quang T. Su
Mechanical Engineering Department,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: qsu@binghamton.edu
Mohammad A. Gharaibeh
Mechanical Engineering Department,
The Hashemite University,
Zarqa 13115, Jordan
e-mail: mohammada_fa@hu.edu.jo
The Hashemite University,
Zarqa 13115, Jordan
e-mail: mohammada_fa@hu.edu.jo
Aaron J. Stewart
Mechanical Engineering Department,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: astewar5@binghamton.edu
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: astewar5@binghamton.edu
James M. Pitarresi
Mechanical Engineering Department,
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Binghamton University,
State University of New York,
4400 Vestal Parkway East,
Binghamton, NY 13902-6000
e-mail: jmp@binghamton.edu
Martin K. Anselm
Manufacturing and Mechanical Engineering
Technology (MMET),
Center for Electronic Manufacturing and
Assembly (CEMA),
Rochester Institute of Technology (RIT),
One Lomb Memorial Drive,
Rochester, NY 14623-5603
e-mail: mkamet@rit.edu
Technology (MMET),
Center for Electronic Manufacturing and
Assembly (CEMA),
Rochester Institute of Technology (RIT),
One Lomb Memorial Drive,
Rochester, NY 14623-5603
e-mail: mkamet@rit.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received July 3, 2017; final manuscript received July 10, 2018; published online August 20, 2018. Assoc. Editor: Jeffrey C. Suhling.
J. Electron. Packag. Dec 2018, 140(4): 041004 (9 pages)
Published Online: August 20, 2018
Article history
Received:
July 3, 2017
Revised:
July 10, 2018
Citation
Su, Q. T., Gharaibeh, M. A., Stewart, A. J., Pitarresi, J. M., and Anselm, M. K. (August 20, 2018). "Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking." ASME. J. Electron. Packag. December 2018; 140(4): 041004. https://doi.org/10.1115/1.4040923
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